SLUSAW9F February   2012  – November 2014 UCC27511 , UCC27512

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 UCC2751x Product Family
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VDD and Undervoltage Lockout
      2. 9.3.2 Operating Supply Current
      3. 9.3.3 Input Stage
      4. 9.3.4 Enable Function
      5. 9.3.5 Output Stage
      6. 9.3.6 Low Propagation Delays
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input-to-Output Logic
        2. 10.2.2.2 Input Threshold Type
        3. 10.2.2.3 VDD Bias Supply Voltage
        4. 10.2.2.4 Peak Source and Sink Currents
        5. 10.2.2.5 Enable and Disable Function
        6. 10.2.2.6 Propagation Delay
        7. 10.2.2.7 Thermal Information
        8. 10.2.2.8 Power Dissipation
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (December 2013) to F Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from D Revision (May 2013) to E Revision

  • Changed OUTL in the ABS Max Ratings table to show DC and Repetitive pulse valuesGo

Changes from C Revision (June 2012) to D Revision

  • Added 0.05 to PSW equation in the Power Dissipation section. Go

Changes from B Revision (March, 2012) to C Revision

  • Added UCC27512 device throughout. Go
  • Added 6-Pin DRS package feature.Go
  • Added DRS pinout for the UCC27512.Go
  • Added UCC27512 TERMINAL FUNCTIONS table.Go
  • Added OUT voltage ab max ratings for the UCC27512.Go
  • Added (5)Go
  • Changed ESD ratings of Human Body Model, HBM from 2000 V to 4000 V.Go
  • Changed ESD ratings of Charged Device Model, CDM SOT-23 from 500 V to 1000 V.Go
  • Added UCC27512 Thermal Information.Go
  • Added power dissipation conditions note to Thermal Information section.Go
  • Added UCC27512 Functional Block Diagram.Go
  • Added UCC27512 application diagrams.Go
  • Added Typical Application Diagram note.Go
  • Added PCB layout bullet.Go