SBOS061C February   1997  – October 2024 XTR105

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-80F0CD5F-C345-42B2-B6A9-580512790460/R_DESCRIPTION_LI1
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Linearization
        1. 6.3.1.1 High-Resistance RTDs
      2. 6.3.2 Voltage Regulator
      3. 6.3.3 Open-Circuit Protection
      4. 6.3.4 Reverse-Voltage Protection
      5. 6.3.5 Surge Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Loop Power Supply
      3. 7.1.3 2-Wire and 3-Wire RTD Connections
      4. 7.1.4 Radio Frequency Interference
      5. 7.1.5 Error Analysis
    2. 7.2 Typical Applications
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision B (August 2004) to Revision C (October 2024)

  • Added the Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Typical Applications, Layout, Layout Guidelines, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added end equipments in Applications Go
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Pin Functions tableGo
  • Moved operating and storage temperature parameters from Electrical Characteristics to Absolute Maximum Ratings Go
  • Changed minimum operating temperature from −55°C to −40°C in Absolute Maximum Ratings Go
  • Moved specified temperature and power-supply parameters from Electrical Characteristics to Recommended Operating Conditions Go
  • Deleted thermal resistance, θ JA parameters in Electrical Characteristics and replaced with detailed thermal model parameters in Thermal Information Go
  • Updated formatting of Electrical Characteristics tableGo
  • Changed Voltage accuracy vs temperature typical specification from ±0.2mV/°C to ±0.5mV/°C in Electrical Characteristics Go
  • Updated Figure 5-2, Step Response Go
  • Updated Figure 5-8, Zero Output and Reference Current Noise vs Frequency Go
  • Changed description of maximum loop-supply voltage to specified absolute maximum rating in Surge Protection Go
  • Updated suggested Zener diode part numbers in Figure 6-4, Reverse Voltage Operation and Overvoltage Surge Protection Go
  • Updated suggested transistor part numbers in Figure 7-1, Basic 2-Wire RTD Temperature Measurement Circuit with Linearization Go
  • Moved Adjusting Initial Errors into Error Analysis section Go