JAJSV01E February   1998  – July 2024 CD54HC4316 , CD74HC4316 , CD74HCT4316

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 概要
  4. 3 Pin Configurations and Functions
  5. 4 Absolute Maximum Ratings
  6. 5 Thermal Information
  7. 6 Recommended Operating Conditions
  8. 7 Electrical Characteristics: HC Devices
  9. 8 Electrical Characteristics: HCT Devices
  10. 9 Switching Characteristics HC
  11. 10Switching Characteristics HCT
  12. 11Analog Channel Specifications
  13. 12HCT Input Loading Table
  14. 13Recommended Operating Area as a Function of Supply Voltage
  15. 14Typical Performance Curves
  16. 15Parameter Measurement Information
  17. 16Detailed Description
    1. 16.1 Functional Block Diagram
    2. 16.2 Device Functional Modes
  18. 17Device and Documentation Support
    1. 17.1 ドキュメントの更新通知を受け取る方法
    2. 17.2 サポート・リソース
    3. 17.3 Trademarks
    4. 17.4 静電気放電に関する注意事項
    5. 17.5 用語集
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • N|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

4 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC – VEE DC Supply voltage -0.5 10.5 V
VCC –0.5 7 V
VEE 0.5 -7 V
IIK  DC input diode current VI < – 0.5 V or VI > VCC + 0.5 V –20 20 mA
IOK  DC switch diode current VI < VEE – 0.5 V or VI < VCC + 0.5 V –25 25 mA
IOK  DC Output Diode Current For VO < -0.5V or VO > VCC + 0.5V –20 20 mA
IO  DC Output Source or Sink Current per Output Pin For VO > -0.5V or VO < VCC + 0.5V –25 25 mA
ICC DC VCC or ground current –50 50 mA
TJMAX
Maximum junction temperature		 150 °C
TLMAX
Maximum lead temperature		 Soldering 10 s 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.