Thermal resistance, active area to test point 1 (TP1)(1)
0.90
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the
package. The cooling system must be capable of
maintaining the package within the temperature
range specified in the Recommended Operating Conditions. The
total heat load on the DMD is largely driven by
the incident light absorbed by the active area;
although other contributions include light energy
absorbed by the window aperture and electrical
power dissipation of the array. Optical systems
must
be designed to minimize the light energy falling
outside the window clear aperture since any
additional thermal load in this area can
significantly degrade the reliability of the
device.