over operating free-air temperature range (unless otherwise noted) (1) | MIN | MAX | UNIT |
---|
SUPPLY VOLTAGES |
VCC | Supply voltage for LVCMOS core logic(2) | –0.5 | 2.3 | V |
VCCI | Supply voltage for LVDS receivers(2) | –0.5 | 2.3 | V |
VOFFSET | Supply voltage for HVCMOS and micromirror electrode(2)(3) | –0.5 | 11 | V |
VBIAS | Supply voltage for micromirror electrode(2) | –0.5 | 19 | V |
VRESET | Supply voltage for micromirror electrode(2) | –15 | –0.3 | V |
|VCC – VCCI| | Supply voltage delta (absolute value)(4) | | 0.3 | V |
|VBIAS – VOFFSET| | Supply voltage delta (absolute value)(5) | | 11 | V |
|VBIAS – VRESET| | Supply voltage delta (absolute value)(6) | | 34 | V |
INPUT VOLTAGES |
| Input voltage for all other LVCMOS input pins(2) | –0.5 | VCC + 0.5 | V |
| Input voltage for all other LVDS input pins(2)(6) | –0.5 | VCCI + 0.5 | V |
|VID| | Input differential voltage (absolute value)(6) | | 500 | mV |
IID | Input differential current(7) | | 6.25 | mA |
CLOCKS |
ƒCLOCK | Clock frequency for LVDS interface: DCLK_A, DCLK_B, DCLK_C,
DCLK_D | | 400 | MHz |
ENVIRONMENTAL |
TARRAY and TWINDOW | Array temperature: operational(8) | 0 | 90 | °C |
Array temperature: non-operational(8) | –40 | 90 | °C |
|TDELTA| | Absolute
temperature
delta between any point on the window edge and the
ceramic test point TP1 (9) | | 30 | °C |
TDP | Dew
point
temperature,
operating and non–operating
(noncondensing) | | 81 | °C |
(1) Operation
outside the Absolute Maximum Ratings may cause
permanent device damage. Absolute Maximum Ratings
do not imply functional operation of the device at
these or any other conditions beyond those listed
under Recommended Operating Conditions. If outside
the Recommended Operating Conditions but within
the Absolute Maximum Ratings, the device may not
be fully functional, and this may affect device
reliability, functionality, performance, and
shorten the device
lifetime.
(2) All voltages are referenced to common ground VSS. VBIAS, VCC, VCCI, VOFFSET, and VRESET power supplies are all required for proper DMD operation. VSS must also be connected.
(3) VOFFSET supply transients must fall within specified voltages.
(4) Exceeding the recommended allowable voltage difference between VCC and VCCI may result in excessive current draw.
(5) Exceeding the recommended allowable voltage difference between VBIAS and VOFFSET may result in excessive current draw.
(6) Exceeding the recommended allowable voltage difference between VBIAS and VRESET may result in excessive current draw.
(7) LVDS differential inputs must not exceed the specified limit or damage may result to the internal termination resistors.
(8) The highest temperature of the active array (as calculated in
Section 7.6)
or of any location along the window edge as
defined in
Figure 7-1.
The locations of thermal test points TP2, TP3,
TP4,
and TP5 in
Figure 7-1
are intended to measure the highest window edge
temperature. If a particular application causes
another location on the window edge to be at a
higher temperature, use that location.
(9) Temperature delta is the highest difference between the ceramic test point 1
(TP1) and anywhere on the window edge as shown in
Figure 7-1.
The window test points TP2, TP3,
TP4,
and TP5 shown in
Figure 7-1
are intended to result in the worst case delta. If
a particular application causes another location
on the window edge to result in a larger delta
temperature, use that location.