JAJSGV8B September 2019 – December 2019 DRV8904-Q1 , DRV8906-Q1 , DRV8908-Q1 , DRV8910-Q1 , DRV8912-Q1
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
This section presents the variation of transient thermal parameters such as the ZθJA (Transient Junction-to-Ambient Thermal Resistance) and ZΨJB (Transient Junction-to-Board Characterization Parameter) with time for 4-layer PCB board with different copper pad area.
Figure 148, Figure 149 and Figure 150 shows the transient junction-to-ambient thermal resistance (ZθJA) vs time for 4-Layer PCB with copper-pad area of 4-cm2, 8-cm2 and 16-cm2 respectively.
Figure 151, Figure 152 and Figure 153 shows the transient junction-to-ambient thermal resistance (ZΨJB) vs time for 4-Layer PCB with copper-pad area of 4-cm2, 8-cm2 and 16-cm2 respectively.