11 Device and Documentation Support
11.1 Device Support
11.1.1 Definition of Terms
Dropout VoltageThe input-voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at (VOUT + 5 V) input, dropout voltage is dependent upon load current and junction temperature.
Input-Output Differential The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will operate.
Input Voltage The DC voltage applied to the input terminals with respect to ground.
Line RegulationThe change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected.
Load RegulationThe change in output voltage for a change in load current at constant chip temperature.
Long Term StabilityOutput voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature.
Output Noise VoltageThe rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range.
Quiescent CurrentThat part of the positive input current that does not contribute to the positive load current. The regulator ground lead current.
Ripple RejectionThe ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VOUTThe percentage change in output voltage for a thermal variation from room temperature to either temperature extreme.
11.2 Documentation Support
11.2.1 Related Documentation
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AN-1520: A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (SNVA183)
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AN-1187: Leadless Leadframe Package (LLP) (SNOA401)
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AN-2020: Thermal Design By Insight, Not Hindsight (SNVA419)
11.3 Related Links
Table 1 below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
11.4 Trademarks
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.