SNVS521K December   2007  – August 2014 LP2998 , LP2998-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Descriptions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings: LP2998
    3. 7.3 Handling Ratings: LP2998-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor
      2. 9.1.2 Output Capacitor
      3. 9.1.3 Thermal Dissipation
    2. 9.2 Typical Application
      1. 9.2.1 DDR-III Applications
      2. 9.2.2 DDR-II Applications
      3. 9.2.3 SSTL-2 Applications
      4. 9.2.4 Level Shifting
        1. 9.2.4.1 Output Capacitor Selection
      5. 9.2.5 HSTL Applications
      6. 9.2.6 QDR Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

5 Revision History

Changes from J Revision (December 2013) to K Revision

  • Added DDR3 support throughout datasheetGo
  • Changed formatting to match new TI datasheet guidelines; added Device Information and Handling Ratings tables, Power Supply, Layout Examples, and Device and Documentation Support sections; reformatted Detailed Description and Application and Implementation sections. Go
  • Changed Electrical Char table condition statement Go

Changes from I Revision (April 2013) to J Revision

  • Added AEC-Q100 Test GuidanceGo
  • Changed layout of National Data Sheet to TI formatGo