JAJSEE2C January   2018  – December 2019 MSP430FR2512 , MSP430FR2522

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode (LPM0) Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics - Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.11.6  Timer_A
        1. Table 5-13 Timer_A
      7. 5.11.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode)
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode)
        5. Table 5-18 eUSCI (SPI Slave Mode)
        6. Table 5-19 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.11.9  CapTIvate
        1. Table 5-23 CapTIvate Electrical Characteristics
        2. Table 5-24 CapTIvate Signal-to-Noise Ratio Characteristics
      10. 5.11.10 FRAM
        1. Table 5-25 FRAM
      11. 5.11.11 Debug and Emulation
        1. Table 5-26 JTAG, Spy-Bi-Wire Interface
        2. Table 5-27 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (Timer0_A3, Timer1_A3)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 CapTIvate Technology
      14. 6.10.14 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.6) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
      2. 7.2.2 CapTIvate Peripheral
        1. 7.2.2.1 Device Connection and Layout Fundamentals
        2. 7.2.2.2 Measurements
          1. 7.2.2.2.1 SNR
          2. 7.2.2.2.2 Sensitivity
          3. 7.2.2.2.3 Power
    3. 7.3 CapTIvate Technology Evaluation
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1  使い始めと次の手順
    2. 8.2  デバイスの項目表記
    3. 8.3  ツールとソフトウェア
    4. 8.4  ドキュメントのサポート
    5. 8.5  関連リンク
    6. 8.6  Community Resources
    7. 8.7  商標
    8. 8.8  静電気放電に関する注意事項
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • RHL|20
サーマルパッド・メカニカル・データ
発注情報

2 改訂履歴

リビジョン B からリビジョン C への変更点

Changes from August 20, 2019 to December 10, 2019

  • Changed the note that begins "Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset..." in Section 5.3, Recommended Operating ConditionsGo
  • Added the note that begins "TI recommends that power to the DVCC pin must not exceed the limits..." in Section 5.3, Recommended Operating ConditionsGo
  • Changed the note that begins "A capacitor tolerance of ±20% or better is required..." in Section 5.3, Recommended Operating ConditionsGo
  • Added the note "See MSP430 32-kHz Crystal Oscillators for details on crystal section, layout, and testing" to Table 5-4, XT1 Crystal Oscillator (Low Frequency)Go
  • Changed the note that begins "Requires external capacitors at both terminals..." in Table 5-4, XT1 Crystal Oscillator (Low Frequency)Go
  • Corrected the test conditions for the RI parameter in Table 5-20, ADC, Power Supply and Input Range ConditionsGo
  • Added the note that begins "tSample = ln(2n+1) × τ ..." in Table 5-21, ADC, 10-Bit Timing ParametersGo
  • Added "1.5-V reference factor" in Table 6-18, Device DescriptorsGo
  • Changed the CRC covered end address to 0x1AF5 in note (1) in Table 6-18, Device DescriptorsGo

Changes from November 8, 2018 to August 19, 2019

  • Section 1.1「特長」を更新 Go
  • Changed CapTIvate BSWP demonstration board to CapTIvate phone demonstration board in note (11) on Section 5.7, Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External CurrentGo
  • Changed CapTIvate BSWP demonstration board to CapTIvate phone demonstration board in note (19) on Section 5.7, Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External CurrentGo
  • Moved CREG and CELECTRODE from Section 5.3, Recommended Operating Conditions to Table 5-23, CapTIvate Electrical CharacteristicsGo
  • Added test condition for CELECTRODE in Table 5-23 , CapTIvate Electrical CharacteristicsGo
  • Changed the symbol and description of the DCCAPCLK parameter in Table 5-23, CapTIvate Electrical CharacteristicsGo
  • Moved the SNR parameter to Table 5-24, CapTIvate Signal-to-Noise Ratio CharacteristicsGo
  • Updated Section 7.2.2, CapTIvate PeripheralGo
  • Section 8.2「デバイスの項目表記」を更新Go

Changes from January 12, 2018 to November 7, 2018

  • Section 1.1「特長」の「近接センシング」の項目から「15cm」を削除Go
  • Section 1.1「特長」で一覧の項目を「3.6V～1.8V の広い電源電圧範囲……」に変更Go
  • Updated Section 3.1, Related ProductsGo
  • Changed HBM limit to ±1000 V and CDM limit to ±250 V in Section 5.2, ESD RatingsGo
  • Changed the MIN value of the VCC parameter from 2 V to 1.8 V in Section 5.3, Recommended Operating ConditionsGo
  • Changed the crystal in the footnote that begins "Characterized with a Seiko Crystal SC-32S crystal..." in Section 5.7, Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External CurrentGo
  • Changed the crystal in the footnote that begins "Characterized with a Seiko Crystal SC-32S crystal..." in Section 5.8, Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External CurrentGo
  • Added note on VSVSH- and VSVSH+ parameters to Table 5-2, PMM, SVS and BORGo
  • Changed the minimum VCC from 2.0 V to 1.8 V in the test conditions for the fREFO, dfREFO/ dVCC, and fDC parameters and in note (2) in Table 5-7, REFOGo
  • Changed the minimum VCC from 2.0 V to 1.8 V in the test conditions for the dfVLO/dVCC parameter and in note (2) in Table 5-8, Internal Very-Low-Power Low-Frequency Oscillator (VLO)Go
  • Changed the minimum VCC from 2.0 V to 1.8 V in the test conditions for the fMODOSC/dVCC parameter in Table 5-9, Module Oscillator (MODOSC)Go
  • Added the SNR parameter in Table 5-23, CapTIvate Electrical CharacteristicsGo
  • Corrected bitfield from RTCCLK to RTCCKSEL in table note that starts "Controlled by ..." in Table 6-8, Clock DistributionGo
  • Corrected bitfield from IRDSEL to IRDSSEL in Section 6.10.8, Timers (Timer0_A3, Timer1_A3), in the description that starts "The interconnection of Timer0_A3 and ..."Go
  • Corrected ADCINCHx column heading in Table 6-13, ADC Channel ConnectionsGo
  • Added P1SELC information in Table 6-28, Port P1, P2 Registers (Base Address: 0200h)Go
  • Added P2SELC information in Table 6-28, Port P1, P2 Registers (Base Address: 0200h)Go