JAJSPZ6F May   2002  – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD05 , SN75HVD06 , SN75HVD07

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1.      Parameter Measurement Information
  6. 6 Function Tables
    1. 6.1 Receiver Failsafe
  7. 7 Equivalent Input and Output Schematic Diagrams
  8. 8 Application and Implementation
    1.     Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 商標
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC(1) D (SOIC)

SN65 Variation

D (SOIC) SN75 Variation

 P (PDIP) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 175.4 125 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.3 53.6 34.9 °C/W
RθJB Junction-to-board thermal resistance 63.4 45.1 23.7 °C/W
ψJT Junction-to-top characterization parameter 8.8 10.1 12.1 °C/W
ψJB Junction-to-board characterization parameter 62.6 44.4 23.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.