JAJSP02C march 2011 – april 2023 TLV3011-Q1 , TLV3011B-Q1 , TLV3012-Q1 , TLV3012B-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TLV3012-Q1 | UNIT | |
---|---|---|---|
DCK (SOT) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 179.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 141.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 71.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 53.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 71.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |