JAJSJH6E august   2020  – july 2023 TLV3604 , TLV3605 , TLV3607

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1.     Pin Configurations: TLV3604 and TLV3605
    2. 5.1 Pin Configuration: TLV3607
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics (VCCI = VCCO = 2.5 V to 5 V)
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Rail-to-Rail Inputs
      2. 7.4.2 LVDS Output
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Comparator Inputs
      2. 8.1.2 Capacitive Loads
      3. 8.1.3 Latch Functionality
      4. 8.1.4 Adjustable Hysteresis
    2. 8.2 Typical Application
      1. 8.2.1 Non-Inverting Comparator With Hysteresis
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Optical Receiver
      3. 8.2.3 Logic Clock Source to LVDS Transceiver
      4. 8.2.4 External Trigger Function for Oscilloscopes
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC TLV3604 TLV3605 TLV3607 UNIT
DCK (SC70) RVK (WQFN) RTE (WQFN)
6 PINS 12 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 170.3 85.8 72.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 134.5 71.6 53.8 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A 15.1 35.7 °C/W
RθJB Junction-to-board thermal resistance 63.3 52.7 45.9 °C/W
ψJT Junction-to-top characterization parameter 43.7 4.1 2.1 °C/W
ψJB Junction-to-board characterization parameter 63.1 52.7 45.9 °C/W