JAJSD84K March   2017  – July 2024 TLV9061 , TLV9062 , TLV9064

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: TLV9061
    5. 5.5  Thermal Information: TLV9061S
    6. 5.6  Thermal Information: TLV9062
    7. 5.7  Thermal Information: TLV9062S
    8. 5.8  Thermal Information: TLV9064
    9. 5.9  Thermal Information: TLV9064S
    10. 5.10 Electrical Characteristics
    11. 5.11 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Rail-to-Rail Input
      2. 6.3.2 Rail-to-Rail Output
      3. 6.3.3 EMI Rejection
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Shutdown Function
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Low-Side Current Sense Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Input and ESD Protection
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information: TLV9061

THERMAL METRIC(1)TLV9061UNIT
DBV (SOT-23)DCK (SC70)DPW (X2SON)
5 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance221.7263.3467°C/W
RθJC(top)Junction-to-case (top) thermal resistance144.775.5211.6°C/W
RθJBJunction-to-board thermal resistance49.751332.2°C/W
ψJTJunction-to-top characterization parameter26.1129.3°C/W
ψJBJunction-to-board characterization parameter4950.3330.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A125°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.