SPNS195C February   2014  – June 2016 TMS570LC4357

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
  4. 4 Terminal Configuration and Functions
    1. 4.1 ZWT BGA Package Ball-Map (337 Terminal Grid Array)
    2. 4.2 Terminal Functions
      1. 4.2.1 ZWT Package
        1. 4.2.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 4.2.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 4.2.1.3  RAM Trace Port (RTP)
        4. 4.2.1.4  Enhanced Capture Modules (eCAP)
        5. 4.2.1.5  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        6. 4.2.1.6  Enhanced Pulse-Width Modulator Modules (ePWM)
        7. 4.2.1.7  Data Modification Module (DMM)
        8. 4.2.1.8  General-Purpose Input / Output (GIO)
        9. 4.2.1.9  FlexRay Interface Controller (FlexRay)
        10. 4.2.1.10 Controller Area Network Controllers (DCAN)
        11. 4.2.1.11 Local Interconnect Network Interface Module (LIN)
        12. 4.2.1.12 Standard Serial Communication Interface (SCI)
        13. 4.2.1.13 Inter-Integrated Circuit Interface Module (I2C)
        14. 4.2.1.14 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        15. 4.2.1.15 Ethernet Controller
        16. 4.2.1.16 External Memory Interface (EMIF)
        17. 4.2.1.17 Embedded Trace Macrocell Interface for Cortex-R5F (ETM-R5)
        18. 4.2.1.18 System Module Interface
        19. 4.2.1.19 Clock Inputs and Outputs
        20. 4.2.1.20 Test and Debug Modules Interface
        21. 4.2.1.21 Flash Supply and Test Pads
        22. 4.2.1.22 Supply for Core Logic: 1.2-V Nominal
        23. 4.2.1.23 Supply for I/O Cells: 3.3-V Nominal
        24. 4.2.1.24 Ground Reference for All Supplies Except VCCAD
        25. 4.2.1.25 Other Supplies
      2. 4.2.2 Multiplexing
        1. 4.2.2.1 Output Multiplexing
          1. 4.2.2.1.1 Notes on Output Multiplexing
        2. 4.2.2.2 Input Multiplexing
          1. 4.2.2.2.1 Notes on Input Multiplexing
          2. 4.2.2.2.2 General Rules for Multiplexing Control Registers
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Device Recommended Operating Conditions
    5. 5.5  Switching Characteristics over Recommended Operating Conditions for Clock Domains
    6. 5.6  Wait States Required - L2 Memories
    7. 5.7  Power Consumption Summary
    8. 5.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 5.9  Thermal Resistance Characteristics for the BGA Package (ZWT)
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1 Input Timings
      2. 5.10.2 Output Timings
  6. 6 System Information and Electrical Specifications
    1. 6.1  Device Power Domains
    2. 6.2  Voltage Monitor Characteristics
      1. 6.2.1 Important Considerations
      2. 6.2.2 Voltage Monitor Operation
      3. 6.2.3 Supply Filtering
    3. 6.3  Power Sequencing and Power-On Reset
      1. 6.3.1 Power-Up Sequence
      2. 6.3.2 Power-Down Sequence
      3. 6.3.3 Power-On Reset: nPORRST
        1. 6.3.3.1 nPORRST Electrical and Timing Requirements
    4. 6.4  Warm Reset (nRST)
      1. 6.4.1 Causes of Warm Reset
      2. 6.4.2 nRST Timing Requirements
    5. 6.5  ARM Cortex-R5F CPU Information
      1. 6.5.1 Summary of ARM Cortex-R5F CPU Features
      2. 6.5.2 Dual Core Implementation
      3. 6.5.3 Duplicate Clock Tree After GCLK
      4. 6.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety
        1. 6.5.4.1 Signal Compare Operating Modes
          1. 6.5.4.1.1 Active Compare Lockstep Mode
          2. 6.5.4.1.2 Self-Test Mode
          3. 6.5.4.1.3 Error Forcing Mode
          4. 6.5.4.1.4 Self-Test Error Forcing Mode
        2. 6.5.4.2 Bus Inactivity Monitor
        3. 6.5.4.3 CPU Registers Initialization
      5. 6.5.5 CPU Self-Test
        1. 6.5.5.1 Application Sequence for CPU Self-Test
        2. 6.5.5.2 CPU Self-Test Clock Configuration
        3. 6.5.5.3 CPU Self-Test Coverage
      6. 6.5.6 N2HET STC / LBIST Self-Test Coverage
    6. 6.6  Clocks
      1. 6.6.1 Clock Sources
        1. 6.6.1.1 Main Oscillator
          1. 6.6.1.1.1 Timing Requirements for Main Oscillator
        2. 6.6.1.2 Low-Power Oscillator
          1. 6.6.1.2.1 Features
          2. 6.6.1.2.2 LPO Electrical and Timing Specifications
        3. 6.6.1.3 Phase-Locked Loop (PLL) Clock Modules
          1. 6.6.1.3.1 Block Diagram
          2. 6.6.1.3.2 PLL Timing Specifications
        4. 6.6.1.4 External Clock Inputs
      2. 6.6.2 Clock Domains
        1. 6.6.2.1 Clock Domain Descriptions
        2. 6.6.2.2 Mapping of Clock Domains to Device Modules
      3. 6.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      4. 6.6.4 Clock Test Mode
    7. 6.7  Clock Monitoring
      1. 6.7.1 Clock Monitor Timings
      2. 6.7.2 External Clock (ECLK) Output Functionality
      3. 6.7.3 Dual Clock Comparators
        1. 6.7.3.1 Features
        2. 6.7.3.2 Mapping of DCC Clock Source Inputs
    8. 6.8  Glitch Filters
    9. 6.9  Device Memory Map
      1. 6.9.1 Memory Map Diagram
      2. 6.9.2 Memory Map Table
      3. 6.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 6.9.4 Master/Slave Access Privileges
        1. 6.9.4.1 Special Notes on Accesses to Certain Slaves
      5. 6.9.5 MasterID to PCRx
      6. 6.9.6 CPU Interconnect Subsystem SDC MMR Port
      7. 6.9.7 Parameter Overlay Module (POM) Considerations
    10. 6.10 Flash Memory
      1. 6.10.1 Flash Memory Configuration
      2. 6.10.2 Main Features of Flash Module
      3. 6.10.3 ECC Protection for Flash Accesses
      4. 6.10.4 Flash Access Speeds
      5. 6.10.5 Flash Program and Erase Timings
        1. 6.10.5.1 Flash Program and Erase Timings for Program Flash
        2. 6.10.5.2 Flash Program and Erase Timings for Data Flash
    11. 6.11 L2RAMW (Level 2 RAM Interface Module)
      1. 6.11.1 L2 SRAM Initialization
    12. 6.12 ECC / Parity Protection for Accesses to Peripheral RAMs
    13. 6.13 On-Chip SRAM Initialization and Testing
      1. 6.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 6.13.1.1 Features
        2. 6.13.1.2 PBIST RAM Groups
      2. 6.13.2 On-Chip SRAM Auto Initialization
    14. 6.14 External Memory Interface (EMIF)
      1. 6.14.1 Features
      2. 6.14.2 Electrical and Timing Specifications
        1. 6.14.2.1 Read Timing (Asynchronous RAM)
        2. 6.14.2.2 Write Timing (Asynchronous RAM)
        3. 6.14.2.3 EMIF Asynchronous Memory Timing
        4. 6.14.2.4 Read Timing (Synchronous RAM)
        5. 6.14.2.5 Write Timing (Synchronous RAM)
    15. 6.15 Vectored Interrupt Manager
      1. 6.15.1 VIM Features
      2. 6.15.2 Interrupt Generation
      3. 6.15.3 Interrupt Request Assignments
    16. 6.16 ECC Error Event Monitoring and Profiling
      1. 6.16.1 EPC Module Operation
        1. 6.16.1.1 Correctable Error Handling
        2. 6.16.1.2 Uncorrectable Error Handling
    17. 6.17 DMA Controller
      1. 6.17.1 DMA Features
      2. 6.17.2 DMA Transfer Port Assignment
      3. 6.17.3 Default DMA Request Map
      4. 6.17.4 Using a GIO terminal as a DMA Request Input
    18. 6.18 Real-Time Interrupt Module
      1. 6.18.1 Features
      2. 6.18.2 Block Diagrams
      3. 6.18.3 Clock Source Options
      4. 6.18.4 Network Time Synchronization Inputs
    19. 6.19 Error Signaling Module
      1. 6.19.1 ESM Features
      2. 6.19.2 ESM Channel Assignments
    20. 6.20 Reset / Abort / Error Sources
    21. 6.21 Digital Windowed Watchdog
    22. 6.22 Debug Subsystem
      1. 6.22.1  Block Diagram
      2. 6.22.2  Debug Components Memory Map
      3. 6.22.3  Embedded Cross Trigger
      4. 6.22.4  JTAG Identification Code
      5. 6.22.5  Debug ROM
      6. 6.22.6  JTAG Scan Interface Timings
      7. 6.22.7  Advanced JTAG Security Module
      8. 6.22.8  Embedded Trace Macrocell (ETM-R5)
        1. 6.22.8.1 ETM TRACECLKIN Selection
        2. 6.22.8.2 Timing Specifications
      9. 6.22.9  RAM Trace Port (RTP)
        1. 6.22.9.1 RTP Features
        2. 6.22.9.2 Timing Specifications
      10. 6.22.10 Data Modification Module (DMM)
        1. 6.22.10.1 DMM Features
        2. 6.22.10.2 Timing Specifications
      11. 6.22.11 Boundary Scan Chain
  7. 7 Peripheral Information and Electrical Specifications
    1. 7.1  Enhanced Translator PWM Modules (ePWM)
      1. 7.1.1 ePWM Clocking and Reset
      2. 7.1.2 Synchronization of ePWMx Time-Base Counters
      3. 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 7.1.5 ePWM Synchronization with External Devices
      6. 7.1.6 ePWM Trip Zones
        1. 7.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 7.1.6.2 Trip Zone TZ4n
        3. 7.1.6.3 Trip Zone TZ5n
        4. 7.1.6.4 Trip Zone TZ6n
      7. 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing
    2. 7.2  Enhanced Capture Modules (eCAP)
      1. 7.2.1 Clock Enable Control for eCAPx Modules
      2. 7.2.2 PWM Output Capability of eCAPx
      3. 7.2.3 Input Connection to eCAPx Modules
      4. 7.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing
    3. 7.3  Enhanced Quadrature Encoder (eQEP)
      1. 7.3.1 Clock Enable Control for eQEPx Modules
      2. 7.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 7.3.3 Input Connection to eQEPx Modules
      4. 7.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 7.4  12-bit Multibuffered Analog-to-Digital Converter (MibADC)
      1. 7.4.1 MibADC Features
      2. 7.4.2 Event Trigger Options
        1. 7.4.2.1 MibADC1 Event Trigger Hookup
        2. 7.4.2.2 MibADC2 Event Trigger Hookup
        3. 7.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 7.4.3 ADC Electrical and Timing Specifications
      4. 7.4.4 Performance (Accuracy) Specifications
        1. 7.4.4.1 MibADC Nonlinearity Errors
        2. 7.4.4.2 MibADC Total Error
    5. 7.5  General-Purpose Input/Output
      1. 7.5.1 Features
    6. 7.6  Enhanced High-End Timer (N2HET)
      1. 7.6.1 Features
      2. 7.6.2 N2HET RAM Organization
      3. 7.6.3 Input Timing Specifications
      4. 7.6.4 N2HET1-N2HET2 Interconnections
      5. 7.6.5 N2HET Checking
        1. 7.6.5.1 Internal Monitoring
        2. 7.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 7.6.6 Disabling N2HET Outputs
      7. 7.6.7 High-End Timer Transfer Unit (HET-TU)
        1. 7.6.7.1 Features
        2. 7.6.7.2 Trigger Connections
    7. 7.7  FlexRay Interface
      1. 7.7.1 Features
      2. 7.7.2 Electrical and Timing Specifications
      3. 7.7.3 FlexRay Transfer Unit
    8. 7.8  Controller Area Network (DCAN)
      1. 7.8.1 Features
      2. 7.8.2 Electrical and Timing Specifications
    9. 7.9  Local Interconnect Network Interface (LIN)
      1. 7.9.1 LIN Features
    10. 7.10 Serial Communication Interface (SCI)
      1. 7.10.1 Features
    11. 7.11 Inter-Integrated Circuit (I2C)
      1. 7.11.1 Features
      2. 7.11.2 I2C I/O Timing Specifications
    12. 7.12 Multibuffered / Standard Serial Peripheral Interface
      1. 7.12.1 Features
      2. 7.12.2 MibSPI Transmit and Receive RAM Organization
      3. 7.12.3 MibSPI Transmit Trigger Events
        1. 7.12.3.1 MIBSPI1 Event Trigger Hookup
        2. 7.12.3.2 MIBSPI2 Event Trigger Hookup
        3. 7.12.3.3 MIBSPI3 Event Trigger Hookup
        4. 7.12.3.4 MIBSPI4 Event Trigger Hookup
        5. 7.12.3.5 MIBSPI5 Event Trigger Hookup
      4. 7.12.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 7.12.5 SPI Slave Mode I/O Timings
    13. 7.13 Ethernet Media Access Controller
      1. 7.13.1 Ethernet MII Electrical and Timing Specifications
      2. 7.13.2 Ethernet RMII Timing
      3. 7.13.3 Management Data Input/Output (MDIO)
  8. 8 Applications, Implementation, and Layout
    1. 8.1 TI Design or Reference Design
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
      2. 9.1.2 Device and Development-Support Tool Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation from Texas Instruments
      2. 9.2.2 Receiving Notification of Documentation Updates
      3. 9.2.3 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
    6. 9.6 Device Identification
      1. 9.6.1 Device Identification Code Register
      2. 9.6.2 Die Identification Registers
    7. 9.7 Module Certifications
      1. 9.7.1 FlexRay Certifications
      2. 9.7.2 DCAN Certification
      3. 9.7.3 LIN Certification
        1. 9.7.3.1 LIN Master Mode
        2. 9.7.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 9.7.3.3 LIN Slave Mode - Adaptive Baud Rate
  10. 10Mechanical Data
    1. 10.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZWT|337
サーマルパッド・メカニカル・データ
発注情報

7 Peripheral Information and Electrical Specifications

7.1 Enhanced Translator PWM Modules (ePWM)

Figure 7-1 shows the connections between the seven ePWM modules (ePWM1–ePWM7) on the device.

TMS570LC4357 ePWMx_interconnections_spns195.gif
A. For more detail on the ePWMx input synchronization selection, see Figure 7-2.
Figure 7-1 ePWMx Module Interconnections

Figure 7-2 shows the detailed input synchronization selection (asynchronous, double-synchronous, or double synchronous + filter width) for ePWMx.

TMS570LC4357 input_sync_selection_epwmx_detailed_spns195.gif Figure 7-2 ePWMx Input Synchronization Selection Detail

7.1.1 ePWM Clocking and Reset

Each ePWM module has a clock enable (ePWMxENCLK) which is controlled by its respective Peripheral Power Down bit in the PSPWRDWNCLRx register of the PCR2 module. To properly reset the peripherals, the peripherals must be released from reset by setting the PENA bit of the CLKCNTL register in the system module. In additional, the peripherals must be released from their power down state by clearing their respective bit in the PSPWRDWNCLRx register. By default after reset, the peripherals are in powerdown state.

Table 7-1 ePWMx Clock Enable Control

ePWM MODULE INSTANCE CONTROL REGISTER TO
ENABLE CLOCK		 DEFAULT VALUE
ePWM1 PSPWRDWNCLR3[16] 1
ePWM2 PSPWRDWNCLR3[17] 1
ePWM3 PSPWRDWNCLR3[18] 1
ePWM4 PSPWRDWNCLR3[19] 1
ePWM5 PSPWRDWNCLR3[12] 1
ePWM6 PSPWRDWNCLR3[13] 1
ePWM7 PSPWRDWNCLR3[14] 1

7.1.2 Synchronization of ePWMx Time-Base Counters

A time-base synchronization scheme connects all of the ePWM modules on a device. Each ePWM module has a synchronization input (EPWMxSYNCI) and a synchronization output (EPWMxSYNCO). The input synchronization for the first instance (ePWM1) comes from an external pin. Figure 7-1 shows the synchronization connections for all the ePWMx modules. Each ePWM module can be configured to use or ignore the synchronization input. For more information, see the ePWM module chapter of the device-specific TRM.

7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base

The connection between the NHET1_LOOP_SYNC and the SYNCI input of ePWM1 module is implemented as shown in Figure 7-3.

TMS570LC4357 sychonizing_tpwmx_n2het_spns195.gif Figure 7-3 Synchronizing Time Bases Between N2HET1, N2HET2 and ePWMx Modules

7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules

The TBCLKSYNC bit can be used to globally synchronize the time-base clocks of all enabled ePWM modules on a device. This bit is implemented as PINMMR166[1] register bit 1.

When TBCLKSYNC = 0, the time-base clock of all ePWM modules is stopped. This is the default condition.

When TBCLKSYNC = 1, all ePWM time-base clocks are started with the rising edge of TBCLK aligned.

For perfectly synchronized TBCLKs, the prescaler bits in the TBCTL register of each ePWM module must be set identically. The proper procedure for enabling the ePWM clocks is as follows:

  • Each ePWM is individually associated with a power down bit in the PSPWRDWNCLRx register of the PCR2 module. Enable the individual ePWM module clocks (if disable) using the control registers in the PCR2.
  • Configure TBCLKSYNC = 0. This will stop the time-base clock within any enabled ePWM module.
  • Configure the prescaler values and desired ePWM modes.
  • Configure TBCLKSYNC = 1.

7.1.5 ePWM Synchronization with External Devices

The output sync from the ePWM1 module is also exported to the I/O Mux such that multiple devices can be synchronized together. The signal pulse must be stretched by 8 VCLK3 cycles before being exported on the IO Mux pin as the ePWMSYNCO signal.

7.1.6 ePWM Trip Zones

The ePWMx modules have 6 trip zone inputs each. These are active-low signals. The application can control the ePWMx module response to each of the trip zone input separately. The timing requirements from the assertion of the trip zone inputs to the actual response are specified in the electrical and timing section of this document.

7.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n

These 3 trip zone inputs are driven by external circuits and are connected to device-level inputs. These signals are either connected asynchronously to the ePWMx trip zone inputs, or double-synchronized with VCLK3, or double-synchronized and then filtered with a 6-cycle VCLK3-based counter before connecting to the ePWMx (see Figure 7-2). By default, the trip zone inputs are asynchronously connected to the ePWMx modules.

Table 7-2 Connection to ePWMx Modules for Device-Level Trip Zone Inputs

TRIP ZONE
INPUT		 CONTROL FOR
ASYNCHRONOUS
CONNECTION TO ePWMx		 CONTROL FOR
DOUBLE-SYNCHRONIZED
CONNECTION TO ePWMx		 CONTROL FOR
DOUBLE-SYNCHRONIZED AND
FILTERED CONNECTION TO ePWMx(1)
TZ1n PINMMR172[18:16] = 001 PINMMR172[18:16] = 010 PINMMR172[18:16] = 100
TZ2n PINMMR172[26:24] = 001 PINMMR172[26:24] = 010 PINMMR172[26:24] = 100
TZ3n PINMMR173[2:0] = 001 PINMMR173[2:0] = 010 PINMMR173[2:0] = 100
(1) The filter width is 6 VCLK3 cycles.

7.1.6.2 Trip Zone TZ4n

This trip zone input is dedicated to eQEPx error indications. There are 2 eQEP modules on this device. Each eQEP module indicates a phase error by driving its EQEPxERR output high. The following control registers allow the application to configure the trip zone input (TZ4n) to each ePWMx module based on the requirements of the applicationapplication's requirements.

Table 7-3 TZ4n Connections for ePWMx Modules

ePWMx CONTROL FOR TZ4n =
NOT(EQEP1ERR OR EQEP2ERR)		 CONTROL FOR TZ4n =
NOT(EQEP1ERR)		 CONTROL FOR TZ4n =
NOT(EQEP2ERR)
ePWM1 PINMMR167[2:0] = 001 PINMMR167[2:0] = 010 PINMMR167[2:0] = 100
ePWM2 PINMMR167[10:8] = 001 PINMMR167[10:8] = 010 PINMMR167[10:8] = 100
ePWM3 PINMMR167[18:16] = 001 PINMMR167[18:16] = 010 PINMMR167[18:16] = 100
ePWM4 PINMMR167[26:24] = 001 PINMMR167[26:24] = 010 PINMMR167[26:24] = 100
ePWM5 PINMMR168[2:0] = 001 PINMMR168[2:0] = 010 PINMMR168[2:0] = 100
ePWM6 PINMMR168[10:8] = 001 PINMMR168[10:8] = 010 PINMMR168[10:8] = 100
ePWM7 PINMMR168[18:16] = 001 PINMMR168[18:16] = 010 PINMMR168[18:16] = 100

NOTE

The EQEPxERR signal is an active high signal coming out of EQEPx module. As listed in Table 7-3, the selected combination of the EQEPxERR signals must be inverted before connecting to the TZ4n input of the ePWMx modules.

7.1.6.3 Trip Zone TZ5n

This trip zone input is dedicated to a clock failure on the device. That is, this trip zone input is asserted whenever an oscillator failure or a PLL slip is detected on the device. The applciation can use this trip zone input for each ePWMx module to prevent the external system from going out of control when the device clocks are not within expected range (system running at limp clock).

The oscillator failure and PLL slip signals used for this trip zone input are taken from the status flags in the system module. These level signals are set until cleared by the application.

7.1.6.4 Trip Zone TZ6n

This trip zone input to the ePWMx modules is dedicated to a debug mode entry of the CPU. If enabled, the user can force the PWM outputs to a known state when the emulator stops the CPU. This prevents the external system from going out of control when the CPU is stopped.

NOTE

There is a signal called DBGACK that the CPU drives when it enters debug mode. This signal must be inverted and used as the Debug Mode Entry signal for the trip zone input.

7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs

A special scheme is implemented to select the actual signal used for triggering the start of conversion on the two ADCs on this device. This scheme is defined in Section 7.4.2.3.

7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing

Table 7-4 ePWMx Timing Requirements

TEST CONDITIONS MIN MAX UNIT
tw(SYNCIN) Synchronization input pulse width Asynchronous 2 tc(VCLK3) cycles
Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width(1) cycles
(1) The filter width is 6 VCLK3 cycles.

Table 7-5 ePWMx Switching Characteristics

PARAMETER TEST CONDITIONS MIN MAX UNIT
tw(PWM) Pulse duration, ePWMx output high or low 33.33 ns
tw(SYNCOUT) Synchronization Output Pulse Width 8 tc(VCLK3) cycles
td(PWM)tza Delay time, trip input active to PWM forced high, OR Delay time, trip input active to PWM forced low No pin load 25 ns
td(TZ-PWM)HZ Delay time, trip input active to PWM Hi-Z 20 ns

Table 7-6 ePWMx Trip-Zone Timing Requirements

TEST CONDITIONS MIN MAX UNIT
tw(TZ) Pulse duration, TZn input low Asynchronous 2 * TBePWMx cycles
Synchronous 2 tc(VCLK3)
Synchronous with input filter 2 tc(VCLK3) + filter width(1)
(1) The filter width is 6 VCLK3 cycles.

7.2 Enhanced Capture Modules (eCAP)

Figure 7-4 shows how the eCAP modules are interconnected on this microcontroller.

TMS570LC4357 eCAP_connections_spns195.gif
A. For more detail on the eCAPx input synchronization selection, see Figure 7-5.
Figure 7-4 eCAP Module Connections

Figure 7-5 shows the detailed input synchronization selection (asynchronous, double-synchronous, or double synchronous + filter width) for eCAPx.

TMS570LC4357 input_sync_selection_ecapx_detailed_spns195.gif Figure 7-5 eCAPx Input Synchronization Selection Detail

7.2.1 Clock Enable Control for eCAPx Modules

Each of the eCAPx modules has a clock enable (ECAPxENCLK) which is controlled by its respective Peripheral Power Down bit in the PSPWRDWNCLRx register of the PCR2 module. To properly reset the peripherals, the peripherals must be released from reset by setting the PENA bit of the CLKCNTL register in the system module. In addition, the peripherals must be released from their power down state by clearing the respective bit in the PSPWRDWNCLRx register. By default, after reset, the peripherals are in the power down state.

Table 7-7 eCAPx Clock Enable Control

eCAP MODULE INSTANCE CONTROL REGISTER TO
ENABLE CLOCK		 DEFAULT VALUE
eCAP1 PSPWRDWNCLR3[15] 1
eCAP2 PSPWRDWNCLR3[8] 1
eCAP3 PSPWRDWNCLR3[9] 1
eCAP4 PSPWRDWNCLR3[10] 1
eCAP5 PSPWRDWNCLR3[11] 1
eCAP6 PSPWRDWNCLR3[4] 1

7.2.2 PWM Output Capability of eCAPx

When not used in capture mode, each of the eCAPx modules can be used as a single-channel PWM output. This is called the Auxiliary PWM (APWM) mode of operation of the eCAPx modules. For more information, see the eCAP module chapter of the device-specific TRM.

7.2.3 Input Connection to eCAPx Modules

The input connection to each of the eCAPx modules can be selected between a double-VCLK3-synchronized input or a double-VCLK3-synchronized and filtered input, as listed in Table 7-8.

Table 7-8 Device-Level Input Connection to eCAPx Modules

INPUT SIGNAL CONTROL FOR
DOUBLE-SYNCHRONIZED
CONNECTION TO eCAPx		 CONTROL FOR
DOUBLE-SYNCHRONIZED AND
FILTERED CONNECTION TO eCAPx(1)
eCAP1 PINMMR169[2:0] = 001 PINMMR169[2:0] = 010
eCAP2 PINMMR169[10:8] = 001 PINMMR169[10:8] = 010
eCAP3 PINMMR169[18:16] = 001 PINMMR169[18:16] = 010
eCAP4 PINMMR169[26:24] = 001 PINMMR169[26:24] = 010
eCAP5 PINMMR170[2:0] = 001 PINMMR170[2:0] = 010
eCAP6 PINMMR170[10:8] = 001 PINMMR170[10:8] = 010
(1) The filter width is 6 VCLK3 cycles.

7.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing

Table 7-9 eCAPx Timing Requirements

TEST CONDITIONS MIN MAX UNIT
tw(CAP) Pulse width, capture input Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width(1) cycles
(1) The filter width is 6 VCLK3 cycles.

Table 7-10 eCAPx Switching Characteristics

PARAMETER TEST CONDITIONS MIN MAX UNIT
tw(APWM) Pulse duration, APWMx output high or low 20 ns

7.3 Enhanced Quadrature Encoder (eQEP)

Figure 7-6 shows the eQEP module interconnections on the device.

TMS570LC4357 eQEP_connections_spns195.gif
A. For more detail on the eQEPx input synchronization selection, see Figure 7-7.
Figure 7-6 eQEP Module Interconnections

Figure 7-7 shows the detailed input synchronization selection (asynchronous, double-synchronous, or double synchronous + filter width) for eQEPx.

TMS570LC4357 input_sync_selection_eqepx_detailed_spns195.gif Figure 7-7 eQEPx Input Synchronization Selection Detail

7.3.1 Clock Enable Control for eQEPx Modules

Each of the EQEPx modules has a clock enable (EQEPxENCLK) which is controlled by its respective Peripheral Power Down bit in the PSPWRDWNCLRx register of the PCR2 module. To properly reset the peripherals, the peripherals must be released from reset by setting the PENA bit of the CLKCNTL register in the system module. In addition, the peripherals must be released from their power down state by clearing the respective bit in the PSPWRDWNCLRx register. By default after reset, the peripherals are in power down state.

Table 7-11 eQEPx Clock Enable Control

eQEP MODULE INSTANCE CONTROL REGISTER TO
ENABLE CLOCK		 DEFAULT VALUE
eQEP1 PSPWRDWNCLR3[5] 1
eQEP2 PSPWRDWNCLR3[6] 1

7.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs

The eQEP module sets the EQEPERR signal output whenever a phase error is detected in its inputs EQEPxA and EQEPxB. This error signal from both the eQEP modules is input to the connection selection multiplexer. This multiplexer is defined in Table 7-3. As shown in Figure 7-6, the output of this selection multiplexer is inverted and connected to the TZ4n trip-zone input of all ePWMx modules. This connection allows the application to define the response of each ePWMx module on a phase error indicated by the eQEP modules.

7.3.3 Input Connection to eQEPx Modules

The input connection to each of the eQEP modules can be selected between a double-VCLK3-synchronized input or a double-VCLK3-synchronized and filtered input, as listed in Table 7-12.

Table 7-12 Device-Level Input Connection to eQEPx Modules

INPUT SIGNAL CONTROL FOR DOUBLE-SYNCHRONIZED
CONNECTION TO eQEPx		 CONTROL FOR
DOUBLE-SYNCHRONIZED AND
FILTERED CONNECTION(1) TO eQEPx
eQEP1A PINMMR170[18:16] = 001 PINMMR170[18:16] = 010
eQEP1B PINMMR170[26:24] = 001 PINMMR170[26:24] = 010
eQEP1I PINMMR171[2:0] = 001 PINMMR171[2:0] = 010
eQEP1S PINMMR171[10:8] = 001 PINMMR171[10:8] = 010
eQEP2A PINMMR171[18:16] = 001 PINMMR171[18:16] = 010
eQEP2B PINMMR171[26:24] = 001 PINMMR171[26:24] = 010
eQEP2I PINMMR172[2:0] = 001 PINMMR172[2:0] = 010
eQEP2S PINMMR172[10:8] = 001 PINMMR172[10:8] = 010
(1) The filter width is 6 VCLK3 cycles.

7.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing

Table 7-13 eQEPx Timing Requirements(1)

TEST CONDITIONS MIN MAX UNIT
tw(QEPP) QEP input period Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width
tw(INDEXH) QEP Index Input High Time Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width
tw(INDEXL) QEP Index Input Low Time Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width
tw(STROBH) QEP Strobe Input High Time Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width
tw(STROBL) QEP Strobe Input Low Time Synchronous 2 tc(VCLK3) cycles
Synchronous with input filter 2 tc(VCLK3) + filter width
(1) The filter width is 6 VCLK3 cycles.

Table 7-14 eQEPx Switching Characteristics

PARAMETER MIN MAX UNIT
td(CNTR)xin Delay time, external clock to counter increment 4 tc(VCLK3) cycles
td(PCS-OUT)QEP Delay time, QEP input edge to position compare sync output 6 tc(VCLK3) cycles

7.4 12-bit Multibuffered Analog-to-Digital Converter (MibADC)

The MibADC has a separate power bus for its analog circuitry that enhances the Analog-to-Digital (A-to-D) performance by preventing digital switching noise on the logic circuitry which could be present on VSS and VCC from coupling into the A-to-D analog stage. All A-to-D specifications are given with respect to ADREFLO, unless otherwise noted.

Table 7-15 MibADC Overview

DESCRIPTION VALUE
Resolution 12 bits
Monotonic Assured
Output conversion code 00h to FFFh [00 for VAI ≤ ADREFLO; FFF for VAI ≥ ADREFHI]

7.4.1 MibADC Features

  • 10-/12-bit resolution
  • ADREFHI and ADREFLO pins (high and low reference voltages)
  • Total Sample/Hold/Convert time: 600 ns Typical Minimum at 30 MHz ADCLK
  • One memory region per conversion group is available (Event Group, Group 1, and Group 2)
  • Allocation of channels to conversion groups is completely programmable
  • Memory regions are serviced either by interrupt or by DMA
  • Programmable interrupt threshold counter is available for each group
  • Programmable magnitude threshold interrupt for each group for any one channel
  • Option to read either 8-, 10-, or 12-bit values from memory regions
  • Single or continuous conversion modes
  • Embedded self-test
  • Embedded calibration logic
  • Enhanced power-down mode
    • Optional feature to automatically power down ADC core when no conversion is in progress
  • External event pin (ADEVT) programmable as general-purpose I/O

7.4.2 Event Trigger Options

The ADC module supports three conversion groups: Event Group, Group1, and Group2. Each of these three groups can be configured to be triggered by a hardware event. In that case, the application can select from among eight event sources to be the trigger for a group's conversions.

7.4.2.1 MibADC1 Event Trigger Hookup

Table 7-16 lists the event sources that can trigger the conversions for the MibADC1 groups.

Table 7-16 MibADC1 Event Trigger Selection

GROUP SOURCE SELECT BITS
(G1SRC, G2SRC OR EVSRC)		 EVENT NO. PINMMR161[0] PINMMR161[1] CONTROL FOR
OPTION A		 CONTROL FOR
OPTION B		 TRIGGER SOURCE
000 1 x x — — AD1EVT
001 2 1 0 PINMMR161[8] = x PINMMR161[9] = x N2HET1[8]
0 1 PINMMR161[8] = 1 PINMMR161[9] = 0 N2HET2[5]
0 1 PINMMR161[8] = 0 PINMMR161[9] = 1 e_TPWM_B
010 3 1 0 — — N2HET1[10]
0 1 — — N2HET1[27]
011 4 1 0 PINMMR161[16] = x PINMMR161[17] = x RTI1 Comp0
0 1 PINMMR161[16] = 1 PINMMR161[17] = 0 RTI1 Comp0
0 1 PINMMR161[16] = 0 PINMMR161[17] = 1 e_TPWM_A1
100 5 1 0 — — N2HET1[12]
0 1 — — N2HET1[17]
101 6 1 0 PINMMR161[24] = x PINMMR161[25] = x N2HET1[14]
0 1 PINMMR161[24] = 1 PINMMR161[25] = 0 N2HET1[19]
0 1 PINMMR161[24] = 0 PINMMR161[25] = 1 N2HET2[1]
110 7 1 0 PINMMR162[0] = x PINMMR162[1] = x GIOB[0]
0 1 PINMMR162[0] = 1 PINMMR162[1] = 0 N2HET1[11]
0 1 PINMMR162[0] = 0 PINMMR162[1] = 1 ePWM_A2
111 8 1 0 PINMMR162[8] = x PINMMR162[9] = x GIOB[1]
0 1 PINMMR162[8] = 1 PINMMR162[9] = 0 N2HET2[13]
0 1 PINMMR162[8] = 0 PINMMR162[9] = 1 ePWM_AB

NOTE

For ADEVT trigger source, the connection to the MibADC1 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by configuring ADEVT as an output function on to the pad (through the mux control), or by driving the ADEVT signal from an external trigger source as input. If the mux control module is used to select different functionality instead of the ADEVT signal, then care must be taken to disable ADEVT from triggering conversions; there is no multiplexing on the input connection.

If ePWM_B, ePWM_A2, ePWM_AB, N2HET2[1], N2HET2[5], N2HET2[13], N2HET1[11], N2HET1[17], or N2HET1[19] is used to trigger the ADC, the connection to the ADC is made directly from the N2HET or ePWM module outputs. As a result, the ADC can be triggered without having to enable the signal from being output on a device terminal.

NOTE

For N2HETx trigger sources, the connection to the MibADC1 module trigger input is made from the input side of the output buffer (at the N2HETx module boundary). This way, a trigger condition can be generated even if the N2HETx signal is not selected to be output on the pad.

NOTE

For the RTI compare 0 interrupt source, the connection is made directly from the output of the RTI module. That is, the interrupt condition can be used as a trigger source even if the actual interrupt is not signaled to the CPU.

7.4.2.2 MibADC2 Event Trigger Hookup

Table 7-17 lists the event sources that can trigger the conversions for the MibADC2 groups.

Table 7-17 MibADC2 Event Trigger Selection

GROUP SOURCE SELECT BITS
(G1SRC, G2SRC, or EVSRC)		 EVENT NO. PINMMR161[0] PINMMR161[1] CONTROL FOR
OPTION A		 CONTROL FOR
OPTION B		 TRIGGER SOURCE
000 1 x x NA NA AD2EVT
001 2 1 0 PINMMR162[16] = x PINMMR162[17] = x N2HET1[8]
0 1 PINMMR162[16] = 1 PINMMR162[17] = 0 N2HET2[5]
0 1 PINMMR162[16] = 0 PINMMR162[17] = 1 e_TPWM_B
010 3 1 0 NA NA N2HET1[10]
0 1 NA NA N2HET1[27]
011 4 1 0 PINMMR162[24] = x PINMMR162[25] = x RTI1 Comp0
0 1 PINMMR162[24] = 1 PINMMR162[25] = 0 RTI1 Comp0
0 1 PINMMR162[24] = 0 PINMMR162[25] = 1 e_TPWM_A1
100 5 1 0 NA NA N2HET1[12]
0 1 NA NA N2HET1[17]
101 6 1 0 PINMMR163[0] = x PINMMR163[0] = x N2HET1[14]
0 1 PINMMR163[0] = 1 PINMMR163[0] = 0 N2HET1[19]
0 1 PINMMR163[0] = 0 PINMMR163[0] = 1 N2HET2[1]
110 7 1 0 PINMMR163[8] = x PINMMR163[8] = x GIOB[0]
0 1 PINMMR163[8] = 1 PINMMR163[8] = 0 N2HET1[11]
0 1 PINMMR163[8] = 0 PINMMR163[8] = 1 ePWM_A2
111 8 1 0 PINMMR163[16] = x PINMMR163[16] = x GIOB[1]
0 1 PINMMR163[16] = 1 PINMMR163[16] = 0 N2HET2[13]
0 1 PINMMR163[16] = 0 PINMMR163[16] = 1 ePWM_AB

NOTE

For AD2EVT trigger source, the connection to the MibADC2 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by configuring AD2EVT as an output function on to the pad (through the mux control), or by driving the AD2EVT signal from an external trigger source as input. If the mux control module is used to select different functionality instead of the AD2EVT signal, then care must be taken to disable AD2EVT from triggering conversions; there is no multiplexing on the input connections.

If ePWM_B, ePWM_A2, ePWM_AB, N2HET2[1], N2HET2[5], N2HET2[13], N2HET1[11], N2HET1[17], or N2HET1[19] is used to trigger the ADC, the connection to the ADC is made directly from the N2HET or ePWM module outputs. As a result, the ADC can be triggered without having to enable the signal from being output on a device terminal.

NOTE

For N2HETx trigger sources, the connection to the MibADC2 module trigger input is made from the input side of the output buffer (at the N2HETx module boundary). This way, a trigger condition can be generated even if the N2HETx signal is not selected to be output on the pad.

NOTE

For the RTI compare 0 interrupt source, the connection is made directly from the output of the RTI module. That is, the interrupt condition can be used as a trigger source even if the actual interrupt is not signaled to the CPU.

7.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules

As shown in Figure 7-8, the ePWMxSOCA and ePWMxSOCB outputs from each ePWM module are used to generate four signals – ePWM_B, ePWM_A1, ePWM_A2, and ePWM_AB, that are available to trigger the ADC based on the application requirement.

TMS570LC4357 ADC_trigger_from_eTPWM_spns185.gif Figure 7-8 ADC Trigger Source Generation from ePWMx

Table 7-18 Control Bit to SOC Output

CONTROL BIT SOC OUTPUT
PINMMR164[0] SOC1A_SEL
PINMMR164[8] SOC2A_SEL
PINMMR164[16] SOC3A_SEL
PINMMR164[24] SOC4A_SEL
PINMMR165[0] SOC5A_SEL
PINMMR165[8] SOC6A_SEL
PINMMR165[16] SOC7A_SEL

The SOCA output from each ePWM module is connected to a "switch" shown in Figure 7-8. This switch is implemented by using the control registers in the PINMMR module. Figure 7-9 is an example of the implementation is shown for the switch on SOC1A. The switches on the other SOCA signals are implemented in the same way.

TMS570LC4357 ePWM1SOCA_switch_spns195.gif Figure 7-9 ePWM1SOC1A Switch Implementation

The logic equations for the four outputs from the combinational logic shown in Figure 7-8 are:

ePWM_B = SOC1B or SOC2B or SOC3B or SOC4B or SOC5B or SOC6B or SOC7B (1)
ePWM_A1 = [ SOC1A and not(SOC1A_SEL) ] or [ SOC2A and not(SOC2A_SEL) ] or [ SOC3A and not(SOC3A_SEL) ] or (2)
[ SOC4A and not(SOC4A_SEL) ] or [ SOC5A and not(SOC5A_SEL) ] or [ SOC6A and not(SOC6A_SEL) ] or
[ SOC7A and not(SOC7A_SEL) ]
ePWM_A2 = [ SOC1A and SOC1A_SEL ] or [ SOC2A and SOC2A_SEL ] or [ SOC3A and SOC3A_SEL ] or (3)
[ SOC4A and SOC4A_SEL ] or [ SOC5A and SOC5A_SEL ] or [ SOC6A and SOC6A_SEL ] or
[ SOC7A and SOC7A_SEL ]
ePWM_AB = ePWM_B or ePWM_A2 (4)

7.4.3 ADC Electrical and Timing Specifications

Table 7-19 MibADC Recommended Operating Conditions

PARAMETER MIN MAX UNIT
ADREFHI A-to-D high-voltage reference source ADREFLO VCCAD(1) V
ADREFLO A-to-D low-voltage reference source VSSAD(1) ADREFHI V
VAI Analog input voltage ADREFLO ADREFHI V
IAIC Analog input clamp current(2) (VAI < VSSAD – 0.3 or VAI > VCCAD + 0.3) –2 2 mA
(1) For VCCAD and VSSAD recommended operating conditions, see Section 5.4.
(2) Input currents into any ADC input channel outside the specified limits could affect conversion results of other channels.

Table 7-20 MibADC Electrical Characteristics Over Full Ranges of Recommended Operating Conditions(2)

PARAMETER DESCRIPTION/CONDITIONS MIN MAX UNIT
Rmux Analog input mux on-resistance See Figure 7-10 250 Ω
Rsamp ADC sample switch on-resistance See Figure 7-10 250 Ω
Cmux Input mux capacitance See Figure 7-10 16 pF
Csamp ADC sample capacitance See Figure 7-10 13 pF
IAIL Analog off-state input leakage current VCCAD = 3.6 V VSSAD ≤ VIN < VSSAD + 100 mV –300 200 nA
VSSAD + 100 mV ≤ VIN ≤ VCCAD - 200 mV –200 200
VCCAD - 200 mV < VIN ≤ VCCAD –200 500
IAIL Analog off-state input leakage current VCCAD = 5.25 V VSSAD ≤ VIN < VSSAD + 300 mV –1000 250 nA
VSSAD + 300 mV ≤ VIN ≤ VCCAD - 300 mV –250 250
VCCAD - 300 mV < VIN ≤ VCCAD –250 1000
IAOSB(1) Analog on-state input bias current VCCAD = 3.6 V VSSAD ≤ VIN < VSSAD + 100 mV –10 2 µA
VSSAD + 100 mV < VIN < VCCAD - 200 mV –4 2
VCCAD - 200 mV < VIN < VCCAD –4 16
IAOSB(1) Analog on-state input bias current VCCAD = 5.25 V VSSAD ≤ VIN < VSSAD + 300 mV –12 3 µA
VSSAD + 300 mV ≤ VIN ≤ VCCAD - 300 mV –5 3
VCCAD - 300 mV < VIN ≤ VCCAD –5 18
(1) If a shared channel is being converted by both ADC converters at the same time, the on-state leakage is doubled.
(2) For ICCAD and ICCREFHI see Section 5.7.
TMS570LC4357 mibadc_circuit_pns160.gif Figure 7-10 MibADC Input Equivalent Circuit

Table 7-21 MibADC Timing Specifications

PARAMETER MIN NOM MAX UNIT
tc(ADCLK)(1) Cycle time, MibADC clock 0.033 µs
td(SH)(2) Delay time, sample and hold time 0.2 µs
12-BIT MODE
td(C) Delay time, conversion time 0.4 µs
td(SHC)(3) Delay time, total sample/hold and conversion time 0.6 µs
10-BIT MODE
td(C) Delay time, conversion time 0.33 µs
td(SHC)(3) Delay time, total sample/hold and conversion time 0.53 µs
(1) The MibADC clock is the ADCLK, generated by dividing down the VCLK1 by a prescale factor defined by the ADCLOCKCR register bits 4:0.
(2) The sample and hold time for the ADC conversions is defined by the ADCLK frequency and the AD<GP>SAMP register for each conversion group. The sample time must be determined by accounting for the external impedance connected to the input channel as well as the internal impedance of the ADC.
(3) This is the minimum sample/hold and conversion time that can be achieved. These parameters are dependent on many factors (for example, the prescale settings).

Table 7-22 MibADC Operating Characteristics Over 3.0 V to 3.6 V Operating Conditions(1)(2)

PARAMETER DESCRIPTION/CONDITIONS MIN MAX UNIT
CR Conversion range over which specified accuracy is maintained ADREFHI - ADREFLO 3 3.6 V
ZSET Zero Scale Offset Difference between the first ideal transition (from code 000h to 001h) and the actual transition 10-bit mode 1 LSB
12-bit mode 2 LSB
FSET Full Scale Offset Difference between the range of the measured code transitions (from first to last) and the range of the ideal code transitions 10-bit mode 2 LSB
12-bit mode 3 LSB
EDNL Differential nonlinearity error Difference between the actual step width and the ideal value. (See Figure 7-11) 10-bit mode –1 1.5 LSB
12-bit mode –1 2 LSB
EINL Integral nonlinearity error Maximum deviation from the best straight line through the MibADC. MibADC transfer characteristics, excluding the quantization error. 10-bit mode –2 2 LSB
12-bit mode –2 2 LSB
ETOT Total unadjusted error (after calibration) Maximum value of the difference between an analog value and the ideal midstep value. 10-bit mode –2 2 LSB
12-bit mode –4 4 LSB
(1) 1 LSB = (ADREFHI – ADREFLO)/ 212 for 12-bit mode
(2) 1 LSB = (ADREFHI – ADREFLO)/ 210 for 10-bit mode

Table 7-23 MibADC Operating Characteristics Over 3.6 V to 5.25 V Operating Conditions(1)(2)

PARAMETER DESCRIPTION/CONDITIONS MIN MAX UNIT
CR Conversion range over which specified accuracy is maintained ADREFHI - ADREFLO 3.6 5.25 V
ZSET Zero Scale Offset Difference between the first ideal transition (from code 000h to 001h) and the actual transition 10-bit mode 1 LSB
12-bit mode 2 LSB
FSET Full Scale Offset Difference between the range of the measured code transitions (from first to last) and the range of the ideal code transitions 10-bit mode 2 LSB
12-bit mode 3 LSB
EDNL Differential nonlinearity error Difference between the actual step width and the ideal value. (See Figure 7-11) 10-bit mode –1 1.5 LSB
12-bit mode –1 3 LSB
EINL Integral nonlinearity error Maximum deviation from the best straight line through the MibADC. MibADC transfer characteristics, excluding the quantization error. 10-bit mode –2 2 LSB
12-bit mode –4.5 2 LSB
ETOT Total unadjusted error (after calibration) Maximum value of the difference between an analog value and the ideal midstep value. 10-bit mode –2 2 LSB
12-bit mode –6 5 LSB

7.4.4 Performance (Accuracy) Specifications

7.4.4.1 MibADC Nonlinearity Errors

The differential nonlinearity error shown in Figure 7-11 (sometimes referred to as differential linearity) is the difference between an actual step width and the ideal value of 1 LSB.

TMS570LC4357 dnl_error_pns160.gif
A. 1 LSB = (ADREFHI – ADREFLO)/212
Figure 7-11 Differential Nonlinearity (DNL) Error

The integral nonlinearity error shown in Figure 7-12 (sometimes referred to as linearity error) is the deviation of the values on the actual transfer function from a straight line.

TMS570LC4357 inl_error_pns160.gif
A. 1 LSB = (ADREFHI – ADREFLO)/212
Figure 7-12 Integral Nonlinearity (INL) Error(A)

7.4.4.2 MibADC Total Error

The absolute accuracy or total error of an MibADC as shown in Figure 7-13 is the maximum value of the difference between an analog value and the ideal midstep value.

TMS570LC4357 total_error_pns160.gif
A. 1 LSB = (ADREFHI – ADREFLO)/212
Figure 7-13 Absolute Accuracy (Total) Error(A)

7.5 General-Purpose Input/Output

The GPIO module on this device supports two ports, GIOA and GIOB. The I/O pins are bidirectional and bit-programmable. Both GIOA and GIOB support external interrupt capability.

7.5.1 Features

The GPIO module has the following features:

  • Each I/O pin can be configured as:
    • Input
    • Output
    • Open Drain
  • The interrupts have the following characteristics:
    • Programmable interrupt detection either on both edges or on a single edge (set in GIOINTDET)
    • Programmable edge-detection polarity, either rising or falling edge (set in GIOPOL register)
    • Individual interrupt flags (set in GIOFLG register)
    • Individual interrupt enables, set and cleared through GIOENASET and GIOENACLR registers respectively
    • Programmable interrupt priority, set through GIOLVLSET and GIOLVLCLR registers
  • Internal pullup/pulldown allows unused I/O pins to be left unconnected

For information on input and output timings see Section 5.10.1 and Section 5.10.2.

7.6 Enhanced High-End Timer (N2HET)

The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse width modulated outputs, capture or compare inputs, or general-purpose I/O.. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses.

7.6.1 Features

The N2HET module has the following features:

  • Programmable timer for input and output timing functions
  • Reduced instruction set (30 instructions) for dedicated time and angle functions
  • 256 words of instruction RAM protected by parity
  • User defined number of 25-bit virtual counters for timer, event counters and angle counters
  • 7-bit hardware counters for each pin allow up to 32-bit resolution in conjunction with the 25-bit virtual counters
  • Up to 32 pins usable for input signal measurements or output signal generation
  • Programmable suppression filter for each input pin with adjustable limiting frequency
  • Low CPU overhead and interrupt load
  • Efficient data transfer to or from the CPU memory with dedicated High-End-Timer Transfer Unit (HTU) or DMA
  • Diagnostic capabilities with different loopback mechanisms and pin status readback functionality

7.6.2 N2HET RAM Organization

The timer RAM uses 4 RAM banks, where each bank has two port access capability. This means that one RAM address may be written while another address is read. The RAM words are 96-bits wide, which are split into three 32-bit fields (program, control, and data).

7.6.3 Input Timing Specifications

The N2HET instructions PCNT and WCAP impose some timing constraints on the input signals.

TMS570LC4357 nhet_input_timings_pns160.gif Figure 7-14 N2HET Input Capture Timings

Table 7-24 Dynamic Characteristics for the N2HET Input Capture Functionality

PARAMETER MIN MAX UNIT
1 Input signal period, PCNT or WCAP for rising edge to rising edge (HRP) (LRP) tc(VCLK2) + 2 225 (HRP) (LRP) tc(VCLK2) - 2 ns
2 Input signal period, PCNT or WCAP for falling edge to falling edge (HRP) (LRP) tc(VCLK2) + 2 225 (HRP) (LRP) tc(VCLK2) - 2 ns
3 Input signal high phase, PCNT or WCAP for rising edge to falling edge 2 (HRP) tc(VCLK2) + 2 225 (HRP) (LRP) tc(VCLK2) - 2 ns
4 Input signal low phase, PCNT or WCAP for falling edge to rising edge 2 (HRP) tc(VCLK2) + 2 225 (HRP) (LRP) tc(VCLK2) - 2 ns

7.6.4 N2HET1-N2HET2 Interconnections

In some applications the N2HET resolutions must be synchronized. Some other applications require a single time base to be used for all PWM outputs and input timing captures.

The N2HET provides such a synchronization mechanism. The Clk_master/slave (HETGCR.16) configures the N2HET in master or slave mode (default is slave mode). A N2HET in master mode provides a signal to synchronize the prescalers of the slave N2HET. The slave N2HET synchronizes its loop resolution to the loop resolution signal sent by the master. The slave does not require this signal after it receives the first synchronization signal. However, anytime the slave receives the resynchronization signal from the master, the slave must synchronize itself again..

TMS570LC4357 nhet_interconnect_pns160.gif Figure 7-15 N2HET1 – N2HET2 Synchronization Hookup

7.6.5 N2HET Checking

7.6.5.1 Internal Monitoring

To assure correctness of the high-end timer operation and output signals, the two N2HET modules can be used to monitor each other’s signals as shown in Figure 7-16. The direction of the monitoring is controlled by the I/O multiplexing control module.

TMS570LC4357 nhet_monitoring_spns195.gif Figure 7-16 N2HET Monitoring

7.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)

N2HET1[31] is connected as a clock source for counter 1 in DCC1. This allows the application to measure the frequency of the pulse-width modulated (PWM) signal on N2HET1[31].

Similarly, N2HET2[0] is connected as a clock source for counter 1 in DCC2. This allows the application to measure the frequency of the pulse-width modulated (PWM) signal on N2HET2[0].

Both N2HET1[31] and N2HET2[0] can be configured to be internal-only channels. That is, the connection to the DCC module is made directly from the output of the N2HETx module (from the input of the output buffer).

For more information on DCC see Section 6.7.3.

7.6.6 Disabling N2HET Outputs

Some applications require the N2HET outputs to be disabled under some fault condition. The N2HET module provides this capability through the "Pin Disable" input signal. This signal, when driven low, causes the N2HET outputs identified by a programmable register (HETPINDIS) to be tri-stated. Refer to the IOMM chapter in the device specific technical reference manual for more details on the "N2HET Pin Disable" feature.

GIOA[5] is connected to the "Pin Disable" input for N2HET1, and GIOB[2] is connected to the "Pin Disable" input for N2HET2.

7.6.7 High-End Timer Transfer Unit (HET-TU)

A High End Timer Transfer Unit (HET-TU) can perform DMA type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HET-TU.

7.6.7.1 Features

  • CPU and DMA independent
  • Master Port to access system memory
  • 8 control packets supporting dual buffer configuration
  • Control packet information is stored in RAM protected by parity
  • Event synchronization (HET transfer requests)
  • Supports 32 or 64 bit transactions
  • Addressing modes for HET address (8 byte or 16 byte) and system memory address (fixed, 32 bit or 64bit)
  • One shot, circular and auto switch buffer transfer modes
  • Request lost detection

7.6.7.2 Trigger Connections

Table 7-25 HET TU1 Request Line Connection

Modules Request Source HET TU1 Request
N2HET1 HTUREQ[0] HET TU1 DCP[0]
N2HET1 HTUREQ[1] HET TU1 DCP[1]
N2HET1 HTUREQ[2] HET TU1 DCP[2]
N2HET1 HTUREQ[3] HET TU1 DCP[3]
N2HET1 HTUREQ[4] HET TU1 DCP[4]
N2HET1 HTUREQ[5] HET TU1 DCP[5]
N2HET1 HTUREQ[6] HET TU1 DCP[6]
N2HET1 HTUREQ[7] HET TU1 DCP[7]

Table 7-26 HET TU2 Request Line Connection

Modules Request Source HET TU2 Request
N2HET2 HTUREQ[0] HET TU2 DCP[0]
N2HET2 HTUREQ[1] HET TU2 DCP[1]
N2HET2 HTUREQ[2] HET TU2 DCP[2]
N2HET2 HTUREQ[3] HET TU2 DCP[3]
N2HET2 HTUREQ[4] HET TU2 DCP[4]
N2HET2 HTUREQ[5] HET TU2 DCP[5]
N2HET2 HTUREQ[6] HET TU2 DCP[6]
N2HET2 HTUREQ[7] HET TU2 DCP[7]

7.7 FlexRay Interface

The FlexRay module performs communication according to the FlexRay protocol specification v2.1. The sample clock bitrate can be programmed to values up to 10 MBit per second. Additional bus driver (BD) hardware is required for connection to the physical layer.

For communication on a FlexRay network, individual message buffers with up to 254 data bytes are configurable. The message storage consists of a single-ported message RAM that holds up to 128 message buffers. All functions concerning the handling of messages are implemented in the message handler. Those functions are the acceptance filtering, the transfer of messages between the two FlexRay Channel Protocol Controllers and the message RAM, maintaining the transmission schedule as well as providing message status information.

The register set of the FlexRay module can be accessed directly by the CPU through the VBUS interface. These registers are used to control, configure and monitor the FlexRay channel protocol controllers, message handler, global time unit, system universal control, frame/symbol processing, network management, interrupt control, and to access the message RAM through the I/O buffer.

7.7.1 Features

The FlexRay module has the following features:

  • Conformance with FlexRay protocol specification v2.1
  • Data rates of up to 10 Mbps on each channel
  • Up to 128 message buffers
  • 8KB of message RAM for storage of for example, 128 message buffers with max. 48 byte data section or up to 30 message buffers with 254 byte data section
  • Configuration of message buffers with different payload lengths
  • One configurable receive FIFO
  • Each message buffer can be configured as receive buffer, as transmit buffer or as part of the receive FIFO
  • CPU access to message buffers through input and output buffer
  • FlexRay Transfer Unit (FTU) for automatic data transfer between data memory and message buffers without CPU interaction
  • Filtering for slot counter, cycle counter, and channel ID
  • Maskable module interrupts
  • Supports Network Management
  • ECC protection on the message RAM

7.7.2 Electrical and Timing Specifications

Table 7-27 Timing Requirements for FlexRay Inputs(1)

Parameter MIN MAX UNIT
tpw Input minimum pulse width to meet the FlexRay sampling requirement tc(VCLKA2) + 2.5(2) ns
(1) tc(VCLKA2) = sample clock cycle time for FlexRay = 1 / f(VCLKA2)
(2) tRxAsymDelay parameter
TMS570LC4357 flexray_inputs_pns160.gif Figure 7-17 FlexRay Inputs

Table 7-28 FlexRay Jitter Timing(2)

PARAMETER MIN MAX UNIT
tTx1bit Clock jitter and signal symmetry 98 102 ns
tTx10bit FlexRay BSS (byte start sequence) to BSS 999 1001 ns
tTx10bitAvg Average over 10000 samples 999.5 1000.5 ns
tRxAsymDelay(1) Delay difference between rise and fall from Rx pin to sample point in FlexRay core – 2.5 ns
tjit(SCLK) Jitter for the 80-MHz Sample Clock generated by the PLL – 0.5 ns
(1) This value is based on design simulation.
(2) This parameter will be characterized, but not production-tested.

7.7.3 FlexRay Transfer Unit

The FlexRay Transfer Unit is able to transfer data between the input buffer (IBF) and output buffer (OBF) of the communication controller and the system memory without CPU interaction.

Because the FlexRay module is accessed through the FTU, the FTU must be powered up by the setting bit 23 in the Peripheral Power Down Registers of the System Module before accessing any FlexRay module register.

For more information on the FTU see the device specific technical reference manual.

7.8 Controller Area Network (DCAN)

The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The DCAN is ideal for applications operating in noisy and harsh environments (e.g., automotive and industrial fields) that require reliable serial communication or multiplexed wiring.

7.8.1 Features

Features of the DCAN module include:

  • Supports CAN protocol version 2.0 part A, B
  • Bit rates up to 1 MBit/s
  • The CAN kernel can be clocked by the oscillator for baud-rate generation.
  • 64 mailboxes on each DCAN
  • Individual identifier mask for each message object
  • Programmable FIFO mode for message objects
  • Programmable loop-back modes for self-test operation
  • Automatic bus on after Bus-Off state by a programmable 32-bit timer
  • Message RAM protected by ECC
  • Direct access to Message RAM during test mode
  • CAN Rx / Tx pins configurable as general purpose IO pins
  • Message RAM Auto Initialization
  • DMA support

For more information on the DCAN see the device specific technical reference manual.

7.8.2 Electrical and Timing Specifications

Table 7-29 Dynamic Characteristics for the DCANx TX and RX pins

Parameter MIN MAX Unit
td(CANnTX) Delay time, transmit shift register to CANnTX pin(1) 15 ns
td(CANnRX) Delay time, CANnRX pin to receive shift register 5 ns
(1) These values do not include rise/fall times of the output buffer.

7.9 Local Interconnect Network Interface (LIN)

The SCI/LIN module can be programmed to work either as an SCI or as a LIN. The core of the module is an SCI. The SCI’s hardware features are augmented to achieve LIN compatibility.

The SCI module is a universal asynchronous receiver-transmitter that implements the standard nonreturn to zero format. The SCI can be used to communicate, for example, through an RS-232 port or over a K-line.

The LIN standard is based on the SCI (UART) serial data link format. The communication concept is single-master/multiple-slave with a message identification for multicast transmission between any network nodes.

7.9.1 LIN Features

The following are features of the LIN module:

  • Compatible to LIN 1.3, 2.0 and 2.1 protocols
  • Multibuffered receive and transmit units DMA capability for minimal CPU intervention
  • Identification masks for message filtering
  • Automatic Master Header Generation
    • Programmable Synch Break Field
    • Synch Field
    • Identifier Field
  • Slave Automatic Synchronization
    • Synch break detection
    • Optional baudrate update
    • Synchronization Validation
  • 231 programmable transmission rates with 7 fractional bits
  • Error detection
  • 2 Interrupt lines with priority encoding

7.10 Serial Communication Interface (SCI)

7.10.1 Features

  • Standard universal asynchronous receiver-transmitter (UART) communication
  • Supports full- or half-duplex operation
  • Standard nonreturn to zero (NRZ) format
  • Double-buffered receive and transmit functions
  • Configurable frame format of 3 to 13 bits per character based on the following:
    • Data word length programmable from one to eight bits
    • Additional address bit in address-bit mode
    • Parity programmable for zero or one parity bit, odd or even parity
    • Stop programmable for one or two stop bits
  • Asynchronous or isosynchronous communication modes
  • Two multiprocessor communication formats allow communication between more than two devices.
  • Sleep mode is available to free CPU resources during multiprocessor communication.
  • The 24-bit programmable baud rate supports 224 different baud rates provide high accuracy baud rate selection.
  • Four error flags and Five status flags provide detailed information regarding SCI events.
  • Capability to use DMA for transmit and receive data.

7.11 Inter-Integrated Circuit (I2C)

The inter-integrated circuit (I2C) module is a multimaster communication module providing an interface between the TMS570 microcontroller and devices compliant with Philips Semiconductor I2C-bus specification version 2.1 and connected by an I2C-bus. This module will support any slave or master I2C compatible device.

7.11.1 Features

The I2C has the following features:

  • Compliance to the Philips I2C bus specification, v2.1 (The I2C Specification, Philips document number 9398 393 40011)
    • Bit/Byte format transfer
    • 7-bit and 10-bit device addressing modes
    • General call
    • START byte
    • Multimaster transmitter/ slave receiver mode
    • Multimaster receiver/ slave transmitter mode
    • Combined master transmit/receive and receive/transmit mode
    • Transfer rates of 10 kbps up to 400 kbps (Phillips fast-mode rate)
  • Free data format
  • Two DMA events (transmit and receive)
  • DMA event enable/disable capability
  • Seven interrupts that can be used by the CPU
  • Module enable/disable capability
  • The SDA and SCL are optionally configurable as general purpose I/O
  • Slew rate control of the outputs
  • Open drain control of the outputs
  • Programmable pullup/pulldown capability on the inputs
  • Supports Ignore NACK mode

NOTE

This I2C module does not support:

  • High-speed (HS) mode
  • C-bus compatibility mode
  • The combined format in 10-bit address mode (the I2C sends the slave address second byte every time it sends the slave address first byte)

7.11.2 I2C I/O Timing Specifications

Table 7-30 I2C Signals (SDA and SCL) Switching Characteristics(1)

PARAMETER STANDARD MODE FAST MODE UNIT
MIN MAX MIN MAX
tc(I2CCLK) Cycle time, Internal Module clock for I2C, prescaled from VCLK 75.2 149 75.2 149 ns
f(SCL) SCL Clock frequency 0 100 0 400 kHz
tc(SCL) Cycle time, SCL 10 2.5 µs
tsu(SCLH-SDAL) Setup time, SCL high before SDA low (for a repeated START condition) 4.7 0.6 µs
th(SCLL-SDAL) Hold time, SCL low after SDA low (for a repeated START condition) 4 0.6 µs
tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs
tw(SCLH) Pulse duration, SCL high 4 0.6 µs
tsu(SDA-SCLH) Setup time, SDA valid before SCL high 250 100 ns
th(SDA-SCLL) Hold time, SDA valid after SCL low (for I2C bus devices) 0 3.45(2) 0 0.9 µs
tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs
tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) 4.0 0.6 µs
tw(SP) Pulse duration, spike (must be suppressed) 0 50 ns
Cb(3) Capacitive load for each bus line 400 400 pF
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.
(2) The maximum th(SDA-SCLL) for I2C bus devices has only to be met if the device does not stretch the low period (tw(SCLL)) of the SCL signal.
(3) Cb = The total capacitance of one bus line in pF.
TMS570LC4357 i2c_timing_pns160.gif Figure 7-18 I2C Timings

NOTE

  • A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL.
  • The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW period (tw(SCLL)) of the SCL signal.
  • A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH).
  • Cb = total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall-times are allowed.

7.12 Multibuffered / Standard Serial Peripheral Interface

The MibSPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed length (2 to 16 bits) to be shifted in and out of the device at a programmed bit-transfer rate. Typical applications for the SPI include interfacing to external peripherals, such as I/Os, memories, display drivers, and analog-to-digital converters.

7.12.1 Features

Both Standard and MibSPI modules have the following features:

  • 16-bit shift register
  • Receive buffer register
  • 11-bit baud clock generator
  • SPICLK can be internally-generated (master mode) or received from an external clock source (slave mode)
  • Each word transferred can have a unique format
  • SPI I/Os not used in the communication can be used as digital input/output signals

Table 7-31 MibSPI Configurations

MibSPIx/SPIx I/Os
MibSPI1 MIBSPI1SIMO[1:0], MIBSPI1SOMI[1:0], MIBSPI1CLK, MIBSPI1nCS[5:0], MIBSPI1nENA
MibSPI3 MIBSPI3SIMO, MIBSPI3SOMI, MIBSPI3CLK, MIBSPI3nCS[5:0], MIBSPI3nENA
MibSPI5 MIBSPI5SIMO[3:0], MIBSPI5SOMI[3:0], MIBSPI5CLK, MIBSPI5nCS[5:0], MIBSPI5nENA
MibSPI2 MIBSPI2SIMO,MIBSPI2SOMI,MIBSPI2CLK,MIBSPI2nCS[1:0],MIBSPI2nENA
MibSPI4 MIBSPI4SIMO,MIBSPI4SOMI,MIBSPI4CLK,MIBSPI4nCS[5:0],MIBSPI4nENA

7.12.2 MibSPI Transmit and Receive RAM Organization

The Multibuffer RAM is comprised of 256 buffers for MibSPI1 and 128 buffers for all other MibSPI. Each entry in the Multibuffer RAM consists of 4 parts: a 16-bit transmit field, a 16-bit receive field, a 16-bit control field and a 16-bit status field. The Multibuffer RAM can be partitioned into multiple transfer groups with a variable number of buffers each.

Multibuffered RAM Transfer Groups

MibSPIx/SPIx
MODULES		 NO OF CHIP
SELECTS		 MIBSPIxnCS[x] NO. OF RAM
BUFFERS		 NO. OF TRANSFER
GROUPS
MibSPI1 6 MIBSPI1nCS[5:0] 256 8
MibSPI2 2 MIBSPI2nCS[1:0] 128 8
MibSPI3 6 MIBSPI3nCS[5:0] 128 8
MibSPI4 6 MIBSPI4nCS[5:0] 128 8
MibSPI5 6 MIBSPI5nCS[5:0] 128 8

7.12.3 MibSPI Transmit Trigger Events

Each of the transfer groups can be configured individually. For each of the transfer groups a trigger event and a trigger source can be chosen. A trigger event can be for example a rising edge or a permanent low level at a selectable trigger source. For example, up to 15 trigger sources are available which can be used by each transfer group.

7.12.3.1 MIBSPI1 Event Trigger Hookup

Table 7-32 MIBSPI1 Event Trigger Hookup

Event # TGxCTRL TRIGSRC[3:0] Trigger
Disabled 0000 No trigger source
EVENT0 0001 GIOA[0]
EVENT1 0010 GIOA[1]
EVENT2 0011 GIOA[2]
EVENT3 0100 GIOA[3]
EVENT4 0101 GIOA[4]
EVENT5 0110 GIOA[5]
EVENT6 0111 GIOA[6]
EVENT7 1000 GIOA[7]
EVENT8 1001 N2HET1[8]
EVENT9 1010 N2HET1[10]
EVENT10 1011 N2HET1[12]
EVENT11 1100 N2HET1[14]
EVENT12 1101 N2HET1[16]
EVENT13 1110 N2HET1[18]
EVENT14 1111 Intern Tick counter

NOTE

For N2HET1 trigger sources, the connection to the MibSPI1 module trigger input is made from the input side of the output buffer (at the N2HET1 module boundary). This way, a trigger condition can be generated even if the N2HET1 signal is not selected to be output on the pad.

NOTE

For GIOx trigger sources, the connection to the MibSPI1 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by selecting the GIOx pin as an output pin plus selecting the pin to be a GIOx pin, or by driving the GIOx pin from an external trigger source. If the mux control module is used to select different functionality instead of the GIOx signal, then care must be taken to disable GIOx from triggering MibSPI1 transfers; there is no multiplexing on the input connections.

7.12.3.2 MIBSPI2 Event Trigger Hookup

Table 7-33 MIBSPI2 Event Trigger Hookup

Event # TGxCTRL TRIGSRC[3:0] Trigger
Disabled 0000 No trigger source
EVENT0 0001 GIOA[0]
EVENT1 0010 GIOA[1]
EVENT2 0011 GIOA[2]
EVENT3 0100 GIOA[3]
EVENT4 0101 GIOA[4]
EVENT5 0110 GIOA[5]
EVENT6 0111 GIOA[6]
EVENT7 1000 GIOA[7]
EVENT8 1001 N2HET1[8]
EVENT9 1010 N2HET1[10]
EVENT10 1011 N2HET1[12]
EVENT11 1100 N2HET1[14]
EVENT12 1101 N2HET1[16]
EVENT13 1110 N2HET1[18]
EVENT14 1111 Intern Tick counter

NOTE

For N2HET1 trigger sources, the connection to the MibSPI1 module trigger input is made from the input side of the output buffer (at the N2HET1 module boundary). This way, a trigger condition can be generated even if the N2HET1 signal is not selected to be output on the pad.

NOTE

For GIOx trigger sources, the connection to the MibSPI1 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by selecting the GIOx pin as an output pin plus selecting the pin to be a GIOx pin, or by driving the GIOx pin from an external trigger source. If the mux control module is used to select different functionality instead of the GIOx signal, then care must be taken to disable GIOx from triggering MibSPI1 transfers; there is no multiplexing on the input connections.

7.12.3.3 MIBSPI3 Event Trigger Hookup

Table 7-34 MIBSPI3 Event Trigger Hookup

Event # TGxCTRL TRIGSRC[3:0] Trigger
Disabled 0000 No trigger source
EVENT0 0001 GIOA[0]
EVENT1 0010 GIOA[1]
EVENT2 0011 GIOA[2]
EVENT3 0100 GIOA[3]
EVENT4 0101 GIOA[4]
EVENT5 0110 GIOA[5]
EVENT6 0111 GIOA[6]
EVENT7 1000 GIOA[7]
EVENT8 1001 H2ET1[8]
EVENT9 1010 N2HET1[10]
EVENT10 1011 N2HET1[12]
EVENT11 1100 N2HET1[14]
EVENT12 1101 N2HET1[16]
EVENT13 1110 N2HET1[18]
EVENT14 1111 Intern Tick counter

NOTE

For N2HET1 trigger sources, the connection to the MibSPI3 module trigger input is made from the input side of the output buffer (at the N2HET1 module boundary). This way, a trigger condition can be generated even if the N2HET1 signal is not selected to be output on the pad.

NOTE

For GIOx trigger sources, the connection to the MibSPI3 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by selecting the GIOx pin as an output pin plus selecting the pin to be a GIOx pin, or by driving the GIOx pin from an external trigger source. If the mux control module is used to select different functionality instead of the GIOx signal, then care must be taken to disable GIOx from triggering MibSPI3 transfers; there is no multiplexing on the input connections.

7.12.3.4 MIBSPI4 Event Trigger Hookup

Table 7-35 MIBSPI4 Event Trigger Hookup

Event # TGxCTRL TRIGSRC[3:0] Trigger
Disabled 0000 No trigger source
EVENT0 0001 GIOA[0]
EVENT1 0010 GIOA[1]
EVENT2 0011 GIOA[2]
EVENT3 0100 GIOA[3]
EVENT4 0101 GIOA[4]
EVENT5 0110 GIOA[5]
EVENT6 0111 GIOA[6]
EVENT7 1000 GIOA[7]
EVENT8 1001 N2HET1[8]
EVENT9 1010 N2HET1[10]
EVENT10 1011 N2HET1[12]
EVENT11 1100 N2HET1[14]
EVENT12 1101 N2HET1[16]
EVENT13 1110 N2HET1[18]
EVENT14 1111 Intern Tick counter

NOTE

For N2HET1 trigger sources, the connection to the MibSPI1 module trigger input is made from the input side of the output buffer (at the N2HET1 module boundary). This way, a trigger condition can be generated even if the N2HET1 signal is not selected to be output on the pad.

NOTE

For GIOx trigger sources, the connection to the MibSPI1 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by selecting the GIOx pin as an output pin plus selecting the pin to be a GIOx pin, or by driving the GIOx pin from an external trigger source. If the mux control module is used to select different functionality instead of the GIOx signal, then care must be taken to disable GIOx from triggering MibSPI1 transfers; there is no multiplexing on the input connections.

7.12.3.5 MIBSPI5 Event Trigger Hookup

Table 7-36 MIBSPI5 Event Trigger Hookup

Event # TGxCTRL TRIGSRC[3:0] Trigger
Disabled 0000 No trigger source
EVENT0 0001 GIOA[0]
EVENT1 0010 GIOA[1]
EVENT2 0011 GIOA[2]
EVENT3 0100 GIOA[3]
EVENT4 0101 GIOA[4]
EVENT5 0110 GIOA[5]
EVENT6 0111 GIOA[6]
EVENT7 1000 GIOA[7]
EVENT8 1001 N2HET1[8]
EVENT9 1010 N2HET1[10]
EVENT10 1011 N2HET1[12]
EVENT11 1100 N2HET1[14]
EVENT12 1101 N2HET1[16]
EVENT13 1110 N2HET1[18]
EVENT14 1111 Intern Tick counter

NOTE

For N2HET1 trigger sources, the connection to the MibSPI5 module trigger input is made from the input side of the output buffer (at the N2HET1 module boundary). This way, a trigger condition can be generated even if the N2HET1 signal is not selected to be output on the pad.

NOTE

For GIOx trigger sources, the connection to the MibSPI5 module trigger input is made from the output side of the input buffer. This way, a trigger condition can be generated either by selecting the GIOx pin as an output pin + selecting the pin to be a GIOx pin, or by driving the GIOx pin from an external trigger source. If the mux control module is used to select different functionality instead of the GIOx signal, then care must be taken to disable GIOx from triggering MibSPI5 transfers; there is no multiplexing on the input connections.

7.12.4 MibSPI/SPI Master Mode I/O Timing Specifications

Table 7-37 SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)(1)(2)(3)

NO. Parameter MIN MAX Unit
1 tc(SPC)M Cycle time, SPICLK(4) 40 256tc(VCLK) ns
2(5) tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M – tr(SPC)M – 3 0.5tc(SPC)M + 3 ns
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M – tf(SPC)M – 3 0.5tc(SPC)M + 3
3(5) tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M – tf(SPC)M – 3 0.5tc(SPC)M + 3 ns
tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M – tr(SPC)M – 3 0.5tc(SPC)M + 3
4(5) td(SPCH-SIMO)M Delay time, SPISIMO valid before SPICLK low (clock polarity = 0) 0.5tc(SPC)M – 6 ns
td(SPCL-SIMO)M Delay time, SPISIMO valid before SPICLK high (clock polarity = 1) 0.5tc(SPC)M – 6
5(5) tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0.5tc(SPC)M – tf(SPC) – 4 ns
tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1) 0.5tc(SPC)M – tr(SPC) – 4
6(5) tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 0) tf(SPC) + 2.2 ns
tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 1) tr(SPC) + 2.2
7(5) th(SPCL-SOMI)M Hold time, SPISOMI data valid after SPICLK low (clock polarity = 0) 10 ns
th(SPCH-SOMI)M Hold time, SPISOMI data valid after SPICLK high (clock polarity = 1) 10
8(6) tC2TDELAY Setup time CS active until SPICLK high (clock polarity = 0) CSHOLD = 0 C2TDELAY*tc(VCLK) + 2*tc(VCLK) - tf(SPICS) + tr(SPC) – 7 (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tr(SPC) + 5.5 ns
CSHOLD = 1 C2TDELAY*tc(VCLK) + 3*tc(VCLK) - tf(SPICS) + tr(SPC) – 7 (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tr(SPC) + 5.5
Setup time CS active until SPICLK low (clock polarity = 1) CSHOLD = 0 C2TDELAY*tc(VCLK) + 2*tc(VCLK) - tf(SPICS) + tf(SPC) – 7 (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tf(SPC) + 5.5 ns
CSHOLD = 1 C2TDELAY*tc(VCLK) + 3*tc(VCLK) - tf(SPICS) + tf(SPC) – 7 (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tf(SPC) + 5.5
9(6) tT2CDELAY Hold time SPICLK low until CS inactive (clock polarity = 0) 0.5*tc(SPC)M + T2CDELAY*tc(VCLK) + tc(VCLK) - tf(SPC) + tr(SPICS) - 7 0.5*tc(SPC)M + T2CDELAY*tc(VCLK) + tc(VCLK) - tf(SPC) + tr(SPICS) + 11 ns
Hold time SPICLK high until CS inactive (clock polarity = 1) 0.5*tc(SPC)M + T2CDELAY*tc(VCLK) + tc(VCLK) - tr(SPC) + tr(SPICS) - 7 0.5*tc(SPC)M + T2CDELAY*tc(VCLK) + tc(VCLK) - tr(SPC) + tr(SPICS) + 11 ns
10 tSPIENA SPIENAn Sample point (C2TDELAY+1) * tc(VCLK) - tf(SPICS) – 29 (C2TDELAY+1)*tc(VCLK) ns
11 tSPIENAW SPIENAn Sample point from write to buffer (C2TDELAY+2)*tc(VCLK) ns
(1) The MASTER bit (SPIGCR1.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared.
(2) tc(VCLK) = interface clock cycle time = 1 / f(VCLK)
(3) For rise and fall timings, see Table 5-5.
(4) When the SPI is in Master mode, the following must be true:
For PS values from 1 to 255: tc(SPC)M ≥ (PS +1)tc(VCLK) ≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: tc(SPC)M = 2tc(VCLK) ≥ 40ns.
The external load on the SPICLK pin must be less than 60pF.
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
(6) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
TMS570LC4357 master_mode_external_timing_phase0_pns160.gif Figure 7-19 SPI Master Mode External Timing (CLOCK PHASE = 0)
TMS570LC4357 master_mode_chip_select_phase0_pns160.gif Figure 7-20 SPI Master Mode Chip Select Timing (CLOCK PHASE = 0)

Table 7-38 SPI Master Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)(1)(2)(3)

NO. Parameter MIN MAX Unit
1 tc(SPC)M Cycle time, SPICLK (4) 40 256tc(VCLK) ns
2(5) tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M – tr(SPC)M – 3 0.5tc(SPC)M + 3 ns
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M – tf(SPC)M – 3 0.5tc(SPC)M + 3
3(5) tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M – tf(SPC)M – 3 0.5tc(SPC)M + 3 ns
tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M – tr(SPC)M – 3 0.5tc(SPC)M + 3
4(5) tv(SIMO-SPCH)M Valid time, SPICLK high after SPISIMO data valid (clock polarity = 0) 0.5tc(SPC)M – 6 ns
tv(SIMO-SPCL)M Valid time, SPICLK low after SPISIMO data valid (clock polarity = 1) 0.5tc(SPC)M – 6
5(5) tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high (clock polarity = 0) 0.5tc(SPC)M – tr(SPC) – 4 ns
tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low (clock polarity = 1) 0.5tc(SPC)M – tf(SPC) – 4
6(5) tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 0) tr(SPC) + 2.2 ns
tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 1) tf(SPC) + 2.2
7(5) tv(SPCH-SOMI)M Valid time, SPISOMI data valid after SPICLK high (clock polarity = 0) 10 ns
tv(SPCL-SOMI)M Valid time, SPISOMI data valid after SPICLK low (clock polarity = 1) 10
8(6) tC2TDELAY Setup time CS active until SPICLK high (clock polarity = 0) CSHOLD = 0 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tr(SPC) – 7 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tr(SPC) + 5.5 ns
CSHOLD = 1 0.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tr(SPC) – 7 0.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tr(SPC) + 5.5
Setup time CS active until SPICLK low (clock polarity = 1) CSHOLD = 0 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tf(SPC) – 7 0.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) - tf(SPICS) + tf(SPC) + 5.5 ns
CSHOLD = 1 0.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tf(SPC) – 7 0.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) - tf(SPICS) + tf(SPC) + 5.5
9(6) tT2CDELAY Hold time SPICLK low until CS inactive (clock polarity = 0) T2CDELAY*tc(VCLK) + tc(VCLK) - tf(SPC) + tr(SPICS) - 7 T2CDELAY*tc(VCLK) + tc(VCLK) - tf(SPC) + tr(SPICS) + 11 ns
Hold time SPICLK high until CS inactive (clock polarity = 1) T2CDELAY*tc(VCLK) + tc(VCLK) - tr(SPC) + tr(SPICS) - 7 T2CDELAY*tc(VCLK) + tc(VCLK) - tr(SPC) + tr(SPICS) + 11 ns
10 tSPIENA SPIENAn Sample Point (C2TDELAY+1)* tc(VCLK) - tf(SPICS) – 29 (C2TDELAY+1)*tc(VCLK) ns
11 tSPIENAW SPIENAn Sample point from write to buffer (C2TDELAY+2)*tc(VCLK) ns
(1) The MASTER bit (SPIGCR1.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set.
(2) tc(VCLK) = interface clock cycle time = 1 / f(VCLK)
(3) For rise and fall timings, see the Table 5-5.
(4) When the SPI is in Master mode, the following must be true:
For PS values from 1 to 255: tc(SPC)M ≥ (PS +1)tc(VCLK) ≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: tc(SPC)M = 2tc(VCLK) ≥ 40ns.
The external load on the SPICLK pin must be less than 60pF.
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
(6) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
TMS570LC4357 master_mode_external_timing_phase1_pns160.gif Figure 7-21 SPI Master Mode External Timing (CLOCK PHASE = 1)
TMS570LC4357 master_mode_chip_select_phase1_pns160.gif Figure 7-22 SPI Master Mode Chip Select Timing (CLOCK PHASE = 1)

7.12.5 SPI Slave Mode I/O Timings

Table 7-39 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO = input, and SPISOMI = output)(1)(2)(3)(4)

NO. Parameter MIN MAX Unit
1 tc(SPC)S Cycle time, SPICLK(5) 40 ns
2(6) tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 14 ns
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 14
3(6) tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 14 ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 14
4(6) td(SPCH-SOMI)S Delay time, SPISOMI valid after SPICLK high (clock polarity = 0) trf(SOMI) + 20 ns
td(SPCL-SOMI)S Delay time, SPISOMI valid after SPICLK low (clock polarity = 1) trf(SOMI) + 20
5(6) th(SPCH-SOMI)S Hold time, SPISOMI data valid after SPICLK high (clock polarity =0) 2 ns
th(SPCL-SOMI)S Hold time, SPISOMI data valid after SPICLK low (clock polarity =1) 2
6(6) tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 0) 4 ns
tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 1) 4
7(6) th(SPCL-SIMO)S Hold time, SPISIMO data valid after SPICLK low (clock polarity = 0) 2 ns
th(SPCH-SIMO)S Hold time, SPISIMO data valid after S PICLK high (clock polarity = 1) 2
8 td(SPCL-SENAH)S Delay time, SPIENAn high after last SPICLK low (clock polarity = 0) 1.5tc(VCLK) 2.5tc(VCLK)+tr(ENAn)+ 22 ns
td(SPCH-SENAH)S Delay time, SPIENAn high after last SPICLK high (clock polarity = 1) 1.5tc(VCLK) 2.5tc(VCLK)+ tr(ENAn) + 22
9 td(SCSL-SENAL)S Delay time, SPIENAn low after SPICSn low (if new data has been written to the SPI buffer) tf(ENAn) tc(VCLK)+tf(ENAn)+27 ns
(1) The MASTER bit (SPIGCR1.0) is cleared and the CLOCK PHASE bit (SPIFMTx.16) is cleared.
(2) If the SPI is in slave mode, the following must be true: tc(SPC)S ≥ (PS + 1) tc(VCLK), where PS = prescale value set in SPIFMTx.[15:8].
(3) For rise and fall timings, see Table 5-5.
(4) tc(VCLK) = interface clock cycle time = 1 /f(VCLK)
(5) When the SPI is in Slave mode, the following must be true:
For PS values from 1 to 255: tc(SPC)S ≥ (PS +1)tc(VCLK) ≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: tc(SPC)S = 2tc(VCLK) ≥ 40ns.
(6) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
TMS570LC4357 slave_mode_external_timing_phase0_pns160.gif Figure 7-23 SPI Slave Mode External Timing (CLOCK PHASE = 0)
TMS570LC4357 slave_mode_enable_timing_phase0_pns160.gif Figure 7-24 SPI Slave Mode Enable Timing (CLOCK PHASE = 0)

Table 7-40 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = input, SPISIMO = input, and SPISOMI = output)(1)(2)(3)(4)

NO. Parameter MIN MAX Unit
1 tc(SPC)S Cycle time, SPICLK(5) 40 ns
2(6) tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 14 ns
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 14
3(6) tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 14 ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 14
4(6) td(SOMI-SPCL)S Dealy time, SPISOMI data valid after SPICLK low (clock polarity = 0) trf(SOMI) + 20 ns
td(SOMI-SPCH)S Delay time, SPISOMI data valid after SPICLK high (clock polarity = 1) trf(SOMI) + 20
5(6) th(SPCL-SOMI)S Hold time, SPISOMI data valid after SPICLK high (clock polarity =0) 2 ns
th(SPCH-SOMI)S Hold time, SPISOMI data valid after SPICLK low (clock polarity =1) 2
6(6) tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 0) 4 ns
tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 1) 4
7(6) tv(SPCH-SIMO)S High time, SPISIMO data valid after SPICLK high (clock polarity = 0) 2 ns
tv(SPCL-SIMO)S High time, SPISIMO data valid after SPICLK low (clock polarity = 1) 2
8 td(SPCH-SENAH)S Delay time, SPIENAn high after last SPICLK high (clock polarity = 0) 1.5tc(VCLK) 2.5tc(VCLK)+tr(ENAn) + 22 ns
td(SPCL-SENAH)S Delay time, SPIENAn high after last SPICLK low (clock polarity = 1) 1.5tc(VCLK) 2.5tc(VCLK)+tr(ENAn) + 22
9 td(SCSL-SENAL)S Delay time, SPIENAn low after SPICSn low (if new data has been written to the SPI buffer) tf(ENAn) tc(VCLK)+tf(ENAn)+ 27 ns
10 td(SCSL-SOMI)S Delay time, SOMI valid after SPICSn low (if new data has been written to the SPI buffer) tc(VCLK) 2tc(VCLK)+trf(SOMI)+ 28 ns
(1) The MASTER bit (SPIGCR1.0) is cleared and the CLOCK PHASE bit (SPIFMTx.16) is set.
(2) If the SPI is in slave mode, the following must be true: tc(SPC)S ≤ (PS + 1) tc(VCLK), where PS = prescale value set in SPIFMTx.[15:8].
(3) For rise and fall timings, see Table 5-5.
(4) tc(VCLK) = interface clock cycle time = 1 /f(VCLK)
(5) When the SPI is in Slave mode, the following must be true:
For PS values from 1 to 255: tc(SPC)S ≥ (PS +1)tc(VCLK) ≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: tc(SPC)S = 2tc(VCLK) ≥ 40ns.
(6) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
TMS570LC4357 slave_mode_external_timing_phase1_pns160.gif Figure 7-25 SPI Slave Mode External Timing (CLOCK PHASE = 1)
TMS570LC4357 slave_mode_enable_timing_phase1_pns160.gif Figure 7-26 SPI Slave Mode Enable Timing (CLOCK PHASE = 1)

7.13 Ethernet Media Access Controller

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QoS) support.

The EMAC controls the flow of packet data from the device to the PHY. The MDIO module controls PHY configuration and status monitoring.

Both the EMAC and the MDIO modules interface to the device through a custom interface that allows efficient data transmission and reception. This custom interface is referred to as the EMAC control module, and is considered integral to the EMAC/MDIO peripheral. The control module is also used to multiplex and control interrupts.

7.13.1 Ethernet MII Electrical and Timing Specifications

TMS570LC4357 mii_receive_timing_pns160.gif Figure 7-27 MII Receive Timing

Table 7-41 MII Receive Timing

Parameter Description MIN MAX
tsu(GMIIMRXD) Setup time, GMIIMRXD to GMIIMRCLK rising edge 8ns
tsu(GMIIMRXDV) Setup time, GMIIMRXDV to GMIIMRCLK rising edge 8ns
tsu(GMIIMRXER) Setup time, GMIIMRXER to GMIIMRCLK rising edge 8ns
th(GMIIMRXD) Hold time, GMIIMRXD valid after GMIIRCLK rising edge 8ns
th(GMIIMRXDV) Hold time, GMIIMRXDV valid after GMIIRCLK rising edge 8ns
th(GMIIMRXER) Hold time, GMIIMRXDV valid after GMIIRCLK rising edge 8ns
TMS570LC4357 mii_transmit_timing_pns160.gif Figure 7-28 MII Transmit Timing

Table 7-42 MII Transmit Timing

Parameter Description MIN MAX
td(GMIIMTXD) Delay time, GMIIMTCLK rising edge to GMIIMTXD 5ns 25ns
td(GMIIMTXEN) Delay time, GMIIMTCLK rising edge to GMIIMTXEN 5ns 25ns

7.13.2 Ethernet RMII Timing

TMS570LC4357 RMII_Timing_Diagram_spns160.gif Figure 7-29 RMII Timing Diagram

Table 7-43 RMII Timing Requirements

NO. Parameter Value Unit
MIN NOM MAX
1 tc(REFCLK) Cycle time, RMII_REF_CLK - 20 - ns
2 tw(REFCLKH) Pulse width, RMII_REF_CLK High 7 - 13 ns
3 tw(REFCLKL) Pulse width, RMII_REF_CLK Low 7 - 13 ns
6 tsu(RXD-REFCLK) Input setup time, RMII_RXD valid before RMII_REF_CLK High 4 - - ns
7 th(REFCLK-RXD) Input hold time, RMII_RXD valid after RMII_REF_CLK High 2 - - ns
8 tsu(CRSDV-REFCLK) Input setup time, RMII_CRSDV valid before RMII_REF_CLK High 4 - - ns
9 th(REFCLK-CRSDV) Input hold time, RMII_CRSDV valid after RMII_REF_CLK High 2 - - ns
10 tsu(RXER-REFCLK) Input setup time, RMII_RXER valid before RMII_REF_CLK High 4 - - ns
11 th(REFCLK-RXER) Input hold time, RMII_RXER valid after RMII_REF_CLK High 2 - - ns
4 td(REFCLK-TXD) Output delay time, RMII_REF_CLK High to RMII_TXD valid 2 - 16 ns
5 td(REFCLK-TXEN) Output delay time, RMII_REF_CLK High to RMII_TX_EN valid 2 - 16 ns

7.13.3 Management Data Input/Output (MDIO)

TMS570LC4357 MDIO_Input_Timing_spns160.gif Figure 7-30 MDIO Input Timing

Table 7-44 MDIO Input Timing Requirements

NO. Parameter Value Unit
MIN MAX
1 tc(MDCLK) Cycle time, MDCLK 400 - ns
2 tw(MDCLK) Pulse duration, MDCLK high/low 180 - ns
3 tt(MDCLK) Transition time, MDCLK - 5 ns
4 tsu(MDIO-MDCLKH) Setup time, MDIO data input valid before MDCLK High 12(1) - ns
5 th(MDCLKH-MDIO) Hold time, MDIO data input valid after MDCLK High 1 - ns
(1) This is a discrepancy to IEEE 802.3, but is compatible with many PHY devices.
TMS570LC4357 MDIO_Output_Timing_spns160.gif Figure 7-31 MDIO Output Timing

Table 7-45 MDIO Output Timing Requirements

NO. Parameter Value Unit
MIN MAX
1 tc(MDCLK) Cycle time, MDCLK 400 - ns
7 td(MDCLKL-MDIO) Delay time, MDCLK low to MDIO data output valid 0 100 ns