SLVSAX6 Data sheet

PRODUCTION DATA.

6 Pin Configuration and Functions

DGN Package

8-Pin MSOP

Top View

D Package

8-Pin SOIC

Top View

DRC Package

10-Pin VSON

Top View

DRB Package

8-Pin SON

Top View

PIN					TYPE⁽³⁾	DESCRIPTION
NAME	MSOP	SOIC	VSON	SON	TYPE⁽³⁾	DESCRIPTION
GND	1	1	1	1	GND	Ground connection
IN	2	2	2, 3	2	I	Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC
EN1	3⁽¹⁾	3⁽⁶⁾	4⁽⁴⁾	—	I	Enable input channel 1, logic high turns on power switch
EN1	–⁽²⁾	–⁽⁷⁾	–⁽⁵⁾	—	I	Enable input channel 1, logic high turns on power switch
EN1	–⁽¹⁾	–⁽⁶⁾	–⁽⁴⁾	3	I	Enable input channel 1, logic low turns on power switch
EN1	3⁽²⁾	3⁽⁷⁾	4⁽⁵⁾	3	I	Enable input channel 1, logic low turns on power switch
EN2	4⁽¹⁾	4⁽⁶⁾	5⁽⁴⁾	—	I	Enable input channel 2, logic high turns on power switch
EN2	–⁽²⁾	–⁽⁷⁾	–⁽⁵⁾	—	I	Enable input channel 2, logic high turns on power switch
EN2	–⁽¹⁾	–⁽⁶⁾	–⁽⁴⁾	4	I	Enable input channel 2, logic low turns on power switch
EN2	4⁽²⁾	4⁽⁷⁾	5⁽⁵⁾	4	I	Enable input channel 2, logic low turns on power switch
FLT2	5	5	6	5	O	Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 2
NC	—	—	7	—	O	No connect – leave floating
OUT2	6	6	8	6	O	Power-switch output channel 2, connected to load
OUT1	7	7	9	7	O	Power-switch output channel 1, connected to load
FLT1	8	8	10	8	O	Active-low open-drain output, asserted during over-current, or overtemperature conditions on channel 1
PowerPAD™	PAD	—	PAD	—	GND	Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect PAD to GND plane as a heatsink.

(1) Applies to TPS2052C, TPS2066C, TPS2066C-2, TPS2064C, and TPS2064C-2

(2) Applies to TPS2062C and TPS2060C

(3) I = Input, O = Output, GND = Ground

(4) Applies to TPS2003C

(5) Applies to TPS2002C

(6) Applies to TPS2066C

(7) Applies to TPS2062C