JAJSP05B May   2023  – October 2023 TPS2000E , TPS2001E , TPS2068E , TPS2069E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6.     13
    7. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable
      3. 7.3.3 Internal Charge Pump
      4. 7.3.4 Current Limit
      5. 7.3.5 FLT
      6. 7.3.6 Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS20xxE UNIT
DBV (SOT-23) DGN (HVSSOP)
PowerPAD™		 DGK (VSSOP)
5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 184.6 51.7 169.6 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 92.6 82.7 65.5
RθJB Junction-to-board thermal resistance 59.9 25.2 90.5
ΨJT Junction-to-top characterization parameter 30.7 6.5 11.8
ΨJB Junction-to-board characterization parameter 59.6 25.2 89.0
RθJC(bot) Junction-to-case (bottom) thermal resistance - 6.4 -
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.