JAJSG28F august   2018  – august 2020 TPS2120 , TPS2121

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1.     8
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Settling Time and Output Soft Start Control (SS)
        1. 9.3.1.1 Slew Rate vs. CSS Capacitor
      2. 9.3.2 Active Current Limiting (ILM)
      3. 9.3.3 Short-Circuit Protection
      4. 9.3.4 Thermal Protection (TSD)
      5. 9.3.5 Overvoltage Protection (OVx)
      6. 9.3.6 Fast Reverse Current Blocking (RCB)
      7. 9.3.7 Output Voltage Dip and Fast Switchover Control (TPS2121 only)
      8. 9.3.8 Input Voltage Comparator (VCOMP)
    4. 9.4 TPS2120 Device Functional Modes
    5. 9.5 TPS2121 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Manual Switchover Schematic
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Description
      4. 10.2.4 Design Procedure
        1. 10.2.4.1 Selecting PR1 and CP2 Resistors
        2. 10.2.4.2 Selecting OVx Resistors
        3. 10.2.4.3 Selecting Soft-Start Capacitor and Current Limit Resistors
      5. 10.2.5 Application Curves
    3. 10.3 Automatic Switchover with Priority (XCOMP)
      1. 10.3.1 Application Schematic
      2. 10.3.2 Design Requirements
      3. 10.3.3 Detailed Design Description
      4. 10.3.4 Design Procedure
        1. 10.3.4.1 Selecting PR1 and CP2 Resistors
      5. 10.3.5 Application Curves
    4. 10.4 Automatic Seamless Switchover with Priority (XREF)
      1. 10.4.1 Application Schematic
      2. 10.4.2 Design Requirements
      3. 10.4.3 Detailed Design Description
      4. 10.4.4 Application Curves
    5. 10.5 Highest Voltage Operation (VCOMP)
      1. 10.5.1 Application Schematic
      2. 10.5.2 Design Requirements
      3. 10.5.3 Detailed Design Description
      4. 10.5.4 Detailed Design Procedure
      5. 10.5.5 Application Curves
    6. 10.6 Reverse Polarity Protection with TPS212x
    7. 10.7 Hotplugging with TPS212x
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Links
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

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メカニカル・データ（パッケージ｜ピン）
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発注情報

7.2 ESD Ratings

PinsVALUEUNIT
VESDElectrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, (1)All±2000V
Charged device model (CDM), per JEDEC specification JESD22-C101, (2)All±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.