SLVSCX7A February 2015 – March 2015 TPS22958
PRODUCTION DATA.
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a discharged load capacitor, a capacitor can be placed between VIN and GND. A 1 µF ceramic capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop during high-current application. When switching heavy loads, TI recommends to have an input capacitor about 10× higher than the output capacitor to avoid excessive voltage drop.
Due to the integrated body diode in the NMOS switch, TI recommends a CIN greater than CL. A CL greater than CIN can cause the voltage on VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. TI recommends a CIN to CL ratio of 10 to 1 for minimizing VIN dip caused by inrush currents during startup.
In many end equipments, there is a need to power up various modules in a pre-determined manner. The TPS22958x can solve the problem of power sequencing without adding any complexity to the overall system. Figure 36 shows the configuration required for powering up two modules in a fixed sequence. The output of the first load switch is tied to the enable of the second load switch, so when Module 1 is powered the second load switch is enabled and Module 2 is powered.
This application demonstrates how the TPS22958 can be used to power a downstream load with a large capacitance. The example in Figure 37 is powering a 22 µF capacitive output load.
For this design example, use the following as the input parameters.
DESIGN PARAMETER | EXAMPLE VALUE |
---|---|
VIN | 3.3 V |
VBIAS | 5.0 V |
Load current | 4 A |
Output capacitance (CL) | 22 µF |
Allowable inrush current on VOUT | 0.33 A |
To begin the design process, the designer needs to know the following:
The VIN to VOUT voltage drop in the device is determined by the RON of the device and the load current. The RON of the device depends upon the VIN and VBIAS conditions of the device. Refer to the RON specification of the device in the Electrical Characteristics table. After the RON of the device is determined based upon the VIN and VBIAS conditions, use Equation 2 to calculate the VIN to VOUT voltage drop:
where
An appropriate ILOAD must be chosen such that the IMAX specification of the device is not violated.
To determine how much inrush current will be caused by the CL capacitor, use Equation 3.
where
The device offers adjustable rise time for VOUT and allows the user to control the inrush current during turn-on through the CT pin. The appropriate rise time can be calculated using the design requirements and the inrush current equation (Equation 3).
To ensure an inrush current of less than 330 mA, choose a CT based on Table 1 or Equation 1 value that will yield a rise time of more than 220 µs. See the oscilloscope captures in the Application Curves for an example of how the CT capacitor can be used to reduce inrush current. See Table 1 for correlation between rise times and CT values.
An appropriate CL value should be placed on VOUT such that the IMAX and IPLS specifications of the device are not violated.
The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 7.
where
For the DGK package, VBIAS = 5 V, and VIN = 3.3 V, the maximum ambient temperature with a 4 A load can be determined by using the following calculation:
Therefore, with the conditions mentioned above, a maximum ambient temperature of 65.6°C is recommended.
For the DGN package, VBIAS = 5 V, and VIN = 3.3 V, the maximum ambient temperature with a 4 A load can be determined by using the following calculation:
Therefore, with the conditions mentioned above, a maximum ambient temperature of 103.6°C is recommended.
The three scope captures show the usage of a CT capacitor in conjunction with the device. A higher CT value results in a slower rise and a lower inrush current.
VBIAS = 5 V | VIN = 3.3 V | TA = 25°C |
CT = Open | CL = 22µF |
VBIAS = 5 V | VIN = 3.3 V | |||
CT = 470 pF | CL = 22µF | TA = 25°C |
VBIAS = 5 V | VIN = 3.3 V | TA = 25°C |
CT = 220 pF | CL = 22µF |