SLVSB99C March   2012  – July 2015 TPS2378

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  APD Auxiliary Power Detect
      2. 7.3.2  CDB Converter Disable Bar Pin Interface
      3. 7.3.3  CLS Classification
      4. 7.3.4  DEN Detection and Enable
      5. 7.3.5  Internal Pass MOSFET
      6. 7.3.6  T2P Type-2 PSE Indicator
      7. 7.3.7  VDD Supply Voltage
      8. 7.3.8  VSS
      9. 7.3.9  PowerPAD
      10. 7.3.10 Forced, Four-Pair, High Power PoE
    4. 7.4 Device Functional Modes
      1. 7.4.1  PoE Overview
      2. 7.4.2  Threshold Voltages
      3. 7.4.3  PoE Start-up Sequence
      4. 7.4.4  Detection
      5. 7.4.5  Hardware Classification
      6. 7.4.6  Inrush and Start-up
      7. 7.4.7  Maintain Power Signature
      8. 7.4.8  Start-up and Converter Operation
      9. 7.4.9  PD Hotswap Operation
      10. 7.4.10 Start-up and Power Management, CDB and T2P
      11. 7.4.11 Adapter ORing
      12. 7.4.12 Using DEN to Disable PoE
      13. 7.4.13 ORing Challenges
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Requirements
        1. 8.2.2.1 Input Bridges and Schottky Diodes
        2. 8.2.2.2 Protection, D1
        3. 8.2.2.3 Capacitor, C1
        4. 8.2.2.4 Detection Resistor, RDEN
        5. 8.2.2.5 Classification Resistor, RCLS
        6. 8.2.2.6 APD Pin Divider Network RAPD1, RAPD2
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 EMI Containment
    4. 10.4 Thermal Considerations and OTSD
    5. 10.5 ESD
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from B Revision (November 2012) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Detailed Pin Description section. Go
  • Deleted CBD Pin Interface sectionGo
  • Deleted APD Pin Divider Network, RAPD1, RAPD2 sectionGo

Changes from A Revision (March 2012) to B Revision

  • Added Application: Forced, Four-Pair, High Power Devices (SLVA625)Go
  • Added Note 1 to the ELECTRICAL CHARACTERISTICS tableGo
  • Added section: Forced, Four-Pair, High Power PoE Go
  • Changed Table 2, From: POWER ≤ 12.95W To: POWER ≤ 13W, From: POWER > 12.95W To POWER > 13W, and PD INPUT POWER (max) From: 12.95 W To 13W Go
  • Changed Table 2, PSE Output Power for 802.3at (Type 2) From: 36W to 30WGo
  • Changed text in the Detection section From: "( ΔV / ΔI ) between 23.75 kΩ and 26.25 kΩ at the PI." To: "( ΔV / ΔI ) between 23.7 kΩ and 26.3 kΩ at the PI." Go
  • Added text to the Startup and Converter Operation section: "Additional loading applied between VVDD and VRTN during the inrush state may prevent successful PD and subsequent converter start up."Go
  • Changed text in the Detection Resistor, RDEN section From: "RDEN between 23.75 kΩ and 26.25 kΩ, or 25 kΩ ± 5%. " To: "RDEN between 23.7 kΩ and 26.3 kΩ, or 25 kΩ ± 5%."Go

Changes from * Revision (March 2012) to A Revision

  • Changed the Inrush termination MAX value From: 100% To: 99%Go