SNVSCN9 September   2024 TPS3424

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD ratings (Industrial)
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Inputs
        1. 7.3.1.1 Push-Button Input (PB)
        2. 7.3.1.2 Push-Button Timing Programmability
        3. 7.3.1.3 KILL
      2. 7.3.2 Outputs
        1. 7.3.2.1 Interrupt (INT)
        2. 7.3.2.2 RESET / RESET
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Power Button Control with TPS3424
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High Voltage Connection
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS3423 / TPS3424 UNIT
DRL (SOT-583) DRL (SOT-563)
8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance °C/W
RθJC(top) Junction-to-case (top) thermal resistance °C/W
RθJB Junction-to-board thermal resistance °C/W
ΨJT Junction-to-top characterization parameter °C/W
ΨJB Junction-to-board characterization parameter °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.