JAJSJ23F September 2019 – October 2023 TPS62860 , TPS62861
PRODUCTION DATA
THERMAL METRIC(1) | DEVICE | UNIT | |
---|---|---|---|
YCH (DSBGA) | |||
8 PINs | |||
RθJA | Junction-to-ambient thermal resistance | 121.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 1.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 33.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 33.5 | °C/W |