JAJS427I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Dynamic Voltage Positioning
      2. 8.3.2 Dynamic Current Limit
      3. 8.3.3 Device Enable
      4. 8.3.4 Power Good
      5. 8.3.5 Overvoltage Protection
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Overtemperature Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Soft-start and Short Circuit Protection
      2. 8.4.2 Buck-Boost Operation
      3. 8.4.3 Control Loop
      4. 8.4.4 Power Save Mode and Synchronization
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design with WEBENCH Tools
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Input Capacitor Selection
        5. 9.2.2.5 Bypass Capacitor
      3. 9.2.3 Setting The Output Voltage
      4. 9.2.4 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Improved Transient Response for 2 A Load Current
      2. 9.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 9.3.3 Low-Power TEC Driver
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 デバイス・サポート
      1. 12.2.1 WEBENCHツールによるカスタム設計
      2. 12.2.2 デベロッパー・ネットワークの製品に関する免責事項
    3. 12.3 ドキュメントのサポート
      1. 12.3.1 関連資料
    4. 12.4 関連リンク
    5. 12.5 サポート・リソース
    6. 12.6 商標
    7. 12.7 静電気放電に関する注意事項
    8. 12.8 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad
  • Introducing airflow in the system

Refer to the Thermal Characteristics Application Note and the Semiconductor and IC Package Thermal Metrics Application Note for more details on how to use the thermal parameters.