JAJSEO3D June 2012 – February 2018 TPS81256
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
In making the pad size for the µSiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 23 shows the appropriate diameters for a MicroSiP layout.