SLVSCE3A June 2014 – June 2014 TPS82740A , TPS82740B
PRODUCTION DATA.
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In making the pad size for the uSiP LGA balls, it is recommended that the layout use a non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 46 shows the appropriate diameters for a MicroSiPTM layout. Figure 47 shows a suggestion for the PCB layout.