Follow these baking guidelines for the WiLink 8 module:
- Follow MSL level 3 to perform the baking process.
- After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.
- If the humidity indicator card reads >10%, devices require baking before they are mounted.
- If baking is required, bake devices for 8 hours at 125°C.