JAJSHW5E September   2009  – July 2024 TS3USB221E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3 V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5 V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3 V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5 V ±10%
    10. 5.10 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Low Power Mode
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision D (September 2019) to Revision E (July 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • Changed ESD HBM performance testing standard from: JESD 22 to: JEDEC JS-001Go
  • Changed ESD CDM performance testing standard from: JESD22-C101 to: JEDEC JS-002Go
  • Added tablenote to the Data input/output voltage parameterGo
  • Changed RSE (UQFN) junction-to-ambient thermal resistance value from: 169.8°C/W to: 204.8°C/WGo
  • Changed RSE (UQFN) junction-to-case (top) thermal resistance value from: 84.7°C/W to: 118.1°C/WGo
  • Changed RSE (UQFN) junction-to-board thermal resistance value from: 94.9°C/W to: 121.5°C/WGo
  • Changed RSE (UQFN) junction-to-top characterization parameter value from: 5.7°C/W to: 13.9°C/WGo
  • Changed RSE (UQFN) junction-to-board characterization parameter value from: 94.9°C/W to: 121.2°C/WGo
  • Changed the VIK value in the Electrical Characteristics table from: –1.8V maximum to: –1.8V minimumGo
  • Changed the graphs in the Typical Characteristics sectionGo

Changes from Revision C (April 2015) to Revision D (September 2019)

  • VCC の動作を 2.5V～3.3V から 2.3V～3.6V に変更Go

Changes from Revision B (July 2012) to Revision C (April 2015)

  • 「ピン構成および機能」セクション、「ESD 定格」表、「熱に関する情報」表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加 Go
  • 「注文情報」表を削除Go

Changes from Revision A (February 2010) to Revision B (July 2012)

  • 「注文情報」表の RSE パッケージの上面マーキングを更新 Go