SBOA446 March   2021 TLV9002-Q1 , TLV9004-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (8) Package
    2. 2.2 VSSOP (8) Package
    3. 2.3 SOIC (14) Package
    4. 2.4 SOT-23 (14) Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (8) and VSSOP (8) Packages
    2. 4.2 SOT-23 (14) and SOIC (14) Packages

1 Overview

This document contains information for TLV9002-Q1 (SOIC (8) and VSSOP (8) packages) and TLV9004-Q1 (SOIC (14) and SOT-23 (14) packages) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-4E2F2755-BC9E-4678-9392-19B23FEE7B11-low.gifFigure 1-1 Functional Block Diagram

TLV9002-Q1 and TLV9004-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.