SFFS525 Functional safety information

SFFS525A September 2022 – November 2022 UCC28C50 , UCC28C51 , UCC28C52 , UCC28C53 , UCC28C54 , UCC28C55 , UCC28C56L , UCC28C57H , UCC28C57L , UCC28C58 , UCC28C59

2.1 SOIC (8) Package

This section provides Functional Safety Failure In Time (FIT) rates for SOIC (8) package of UCCx8C5x based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total Component FIT Rate (71.6 mW, 150 mW, 300 mW)	10, 11, 15
Die FIT Rate (71.6 mW, 150 mW, 300 mW)	3, 4, 7
Package FIT Rate (71.6 mW, 150 mW, 300 mW)	7, 7, 8

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 71.6 mW, 150mW, 300mW
Climate type: World-wide Table 8
Package factor (lambda 3): Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog / mixed	25 FIT	55°C

The Reference FIT Rate and Reference Virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.