SLLA621A September   2023  – October 2023 MCF8315A , MCF8316A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design Challenge 1: Thermal Challenges
    1. 2.1 Causes of Thermal Issues
    2. 2.2 How to Solve Thermal Issues
      1. 2.2.1 Solve the Thermal Problem From Hardware
      2. 2.2.2 Solve the Thermal Problem from Algorithm
        1. 2.2.2.1 MCF8315 Test 1
        2. 2.2.2.2 MCF8315 Test 2
        3. 2.2.2.3 MCF8316 Test 1
        4. 2.2.2.4 MCF8316 Test 2
      3. 2.2.3 Solve the Thermal Challenges From PCB Layout
  6. 3Design Challenge 2: Quick Startup
    1. 3.1 Causes of Quick Startup Issues
    2. 3.2 How to Solve Quick Startup Issues
  7. 4Summary
    1. 4.1 Acknowledgment
  8. 5References
  9. 6Revision History

2 Design Challenge 1: Thermal Challenges

For single-chip integration designs, especially designs with integrated FETs, customers will worry about the thermal performance of the device. If the customer's application is relatively closed-off and there is no good heat dissipation, they will pay more attention to the thermal performance of the device. For example, for the application of ceiling fans and water pumps, the PCB is placed in the motor and is in a closed-off environment. So thermal design is a challenge for MCF831x, the following is the analysis for this challenge.