The MicroSiP™ package is Texas Instrument’s latest response to the market’s ever-increasing demand for smaller and smaller components, and MicroSiP comes with a massive increase in power density when compared to previous designs. The MicroSiP package manages this by integrating inductor and other external components into one compact package. To achieve this, while keeping the size of the package small, the passive components are integrated vertically rather than horizontally. The integrated circuit of the chip is embedded inside a PCB substrate. Then passive components, for example, capacitors and inductors, are stacked and soldered on the top of the PCB. The MicroSiP packaging uses ball grid array pins with the total vertical thickness of the package being the combined thickness of the ball grid array, the PCB substrate, and the passive components. This is how the TPSM843620 family achieves a compact package size of 12.25 mm² with a height of only 1.6 mm.

Figure 2-1 MicroSiP Package Example

The TPSM843620 family has higher power density when compared to the TPS543620 family because of the small MicroSiP package. The compact design can greatly reduce the overall design size. This design can be used to cut down on board space and cost. Alternatively, the additional space saved due to the smaller form factor can be used to add more features to the product that cannot be possible in a design with space constraints if the TPS543620 family was used.