SLVAEV3A June   2020  – November 2022 TPS546D24A , TPS54824

 

  1.   Collection of DC/DC Buck Regulator Technical Documentation
  2.   Trademarks
  3. 1 Low Noise
  4. 2 Power Density
  5. 3 Thermals
  6. 4 Control-Mode Architectures
  7. 5 Powering Performance FPGAs, ASICs, and SoC
  8. 6 Light-Load and Full-Load Efficiency
  9. 7 Layout
  10. 8 Power Supply Topology
  11. 9 Packaging
  12. 10Revision History

2 Power Density

While power demands increase, board area and height are becoming limiting factors. Power designer must squeeze more circuitry into their applications to differentiate their products, while increasing efficiency and enhancing thermal performance. TI continues investing in advanced technology and develops solutions enabling designers to attain best-in-class power density. Higher power levels in smaller form-factors are now achievable using TI’s advanced circuit-design, process, and packaging technology.

Table 2-1 Power Density Documentation
Document TitleLiterature #
Maximizing power density and thermal performance in power-module designsSLYT761
Space Optimized, “Clam Shell” Layout for Step-Down DC/DC ConvertersSLVA818
Breakthrough Power Delivery for Space-Constrained ApplicationsSSZY023