SLVUAK3C February   2016  – May 2021 TPS82130 , TPS82140 , TPS82150

 

  1. 1Introduction
    1. 1.1 Performance Specification
    2. 1.2 Thermal Data
    3. 1.3 Modifications
      1. 1.3.1 Input and Output Capacitors
  2. 2Setup
    1. 2.1 Input/Output Connector Descriptions
    2. 2.2 Setup
  3. 3PWR720 EVM Test Results
  4. 4Board Layout
  5. 5Schematic and Bill of Materials
    1. 5.1 Schematic
    2. 5.2 Bill of Materials
  6. 6Revision History

1.2 Thermal Data

Table 1-3 shows the PWR720 EVM thermal data after considering the printed-circuit board (PCB) design of real applications. Compared to the JEDEC values listed in the data sheet, the PWR720 EVM design uses thicker copper on the 2 internal layers, has bigger planes connecting to the IC, and uses a thinner PCB. These improve the thermal performance. But the PCB is smaller than the standard JEDEC PCB, and this decreases the thermal performance. Overall, these differences improve the thermal performance and more closely match a real end application.

Table 1-3 PWR720 EVM Thermal Data
Thermal Metric(1)TPS821x0EVM-720TPS821x0 Data Sheet (JEDEC 51-5)Unit
RθJAJunction-to-ambient thermal resistance46.158.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance9.49.4
RθJBJunction-to-board thermal resistance14.414.4
ψJTJunction-to-top characterization parameter0.90.9
ψJBJunction-to-board characterization parameter14.014.2
RθJC(bot)Junction-to-case (bottom) thermal resistance21.321.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.