SNAU250 November   2020 HDC2010 , HDC2021 , HDC2022 , HDC2080

 

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2.2.1 Assembly

The HDC must be added in the last assembly step. In case the PCB passes through multiple solder cycles (as is the case for PCBs that have components on the top and bottom side), adding the HDC last reduces the risk of damage to the sensing polymer from contaminants or excessive heat. Contaminants such as those listed in Section 2.1must be avoided or minimized. Maximum assembly temperatures and exposure times must not be exceeded.

Note:

It is important that no-clean solder paste is used and no board wash is applied once the sensor is assembled onto the PCB. To ensure proper device performance, these instructions should be communicated to board manufacturers before assembly.