SNIA043A july   2021  – april 2023 TMP114 , TMP144

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Heat Sink Temperature Sensor Monitoring
  5. 3Component Temperature Monitoring With Adjacent PCB Placement
  6. 4Under-Component Temperature Monitoring
    1. 4.1 Ultra-Thin Temperature Sensors
    2. 4.2 Designing an Under-Component Layout With the TMP114 Temperature Sensor
    3. 4.3 Under-Component Experimental Results
  7. 5Summary
  8. 6References
  9. 7Revision History

Abstract

Accurate processor and component temperature monitoring is critical in applications where temperature compensation is needed, or where operation around the system temperature limits is required. Higher sensing accuracy in these kinds of use-cases directly affects the quality or uptime of the system. The new ultra-thin TMP114, and TMP144 digital temperature sensors from TI provide another option to achieve high-accuracy component temperature monitoring, without calibration, and without additional board space, by placing the IC themselves underneath critical components. This note introduces the idea of under-component temperature monitoring, and briefly compares it to other potential temperature sensing layouts.