SNIA043A july   2021  – april 2023 TMP114 , TMP144

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Heat Sink Temperature Sensor Monitoring
  5. 3Component Temperature Monitoring With Adjacent PCB Placement
  6. 4Under-Component Temperature Monitoring
    1. 4.1 Ultra-Thin Temperature Sensors
    2. 4.2 Designing an Under-Component Layout With the TMP114 Temperature Sensor
    3. 4.3 Under-Component Experimental Results
  7. 5Summary
  8. 6References
  9. 7Revision History

Under-Component Temperature Monitoring

Figure 4-1 shows a thermal capture of the AWR2243BOOST evaluation module (EVM) mounted onto the DCA1000EVM for data capture. The HI temperature reading shows the AWR2243 has reached a temperature of about 51.5 °C, and is therefore operating at a moderate load. The LO value displayed is the ambient temperature of around 22.9 °C, and the board temperature as measured by the thermal camera is at 41.9 °C.

GUID-20210727-CA0I-FQPD-KDDN-PD0MP6RD0CN0-low.svg Figure 4-1 Thermal Capture of AWR2243BOOST Under Moderate Load

Unlike the simulation example shown in Figure 3-1, the heat source here has only a temperature differential from ambient of less than 30 °C, and yet the temperature of the board immediately adjacent to the AWR2243 has already dropped by nearly 10 degrees. It should be evident from this that in order to use an external sensor to accurately monitor the temperature of certain components, it is going to be necessary to get the sensor as close as possible to the device to be monitored.