SPRACP4A December   2019  – June 2024 AM67 , AM67A , AM68 , AM69 , DRA829J , DRA829V , TDA4AEN-Q1 , TDA4VEN-Q1 , TDA4VH-Q1 , TDA4VM , TDA4VM-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Overview
    2. 1.2 Supporting Documentation
  5. 2High-Speed Interface Design Guidance
    1. 2.1  Trace Impedance
    2. 2.2  Trace Lengths
    3. 2.3  Differential Signal Length Matching
    4. 2.4  Signal Reference Planes
    5. 2.5  Differential Signal Spacing
    6. 2.6  Additional Differential Signal Rules
    7. 2.7  Symmetry in the Differential Pairs
    8. 2.8  Connectors and Receptacles
    9. 2.9  Via Discontinuity Mitigation
    10. 2.10 Back-Drill Via Stubs
    11. 2.11 Via Anti-Pad Diameter
    12. 2.12 Equalize Via Count
    13. 2.13 Surface-Mount Device Pad Discontinuity Mitigation
    14. 2.14 Signal Bending
    15. 2.15 ESD and EMI Considerations
    16. 2.16 ESD and EMI Layout Rules
  6. 3Interface-Specific Design Guidance
    1. 3.1 USB Board Design and Layout Guidelines
      1. 3.1.1 USB Interface Schematic
        1. 3.1.1.1 Support Components
      2. 3.1.2 Routing Specifications
    2. 3.2 DisplayPort Board Design and Layout Guidelines
      1. 3.2.1 DP Interface Schematic
        1. 3.2.1.1 Support Components
      2. 3.2.2 Routing Specifications
    3. 3.3 PCIe Board Design and Layout Guidelines
      1. 3.3.1 PCIe Interface Schematic
        1. 3.3.1.1 Polarity Inversion
        2. 3.3.1.2 Lane Swap
        3. 3.3.1.3 REFCLK Connections
        4. 3.3.1.4 Coupling Capacitors
      2. 3.3.2 Routing Specifications
    4. 3.4 MIPI® D-PHY (CSI2, DSI) Board Design and Layout Guidelines
      1. 3.4.1 CSI-2®, DSI® Interface Schematic
      2. 3.4.2 Routing Specifications
      3. 3.4.3 Frequency-Domain Specification Guidelines
    5. 3.5 UFS Board Design and Layout Guidelines
      1. 3.5.1 UFS Interface Schematic
      2. 3.5.2 Routing Specifications
    6. 3.6 Q/SGMII Board Design and Layout Guidelines
      1. 3.6.1 Q/SGMII Interface Schematic
        1. 3.6.1.1 Coupling Capacitors
      2. 3.6.2 Routing Specifications
  7. 4Board Design Simulations
    1. 4.1 Board Model Extraction
    2. 4.2 Board-Model Validation
    3. 4.3 S-Parameter Inspection
    4. 4.4 Time Domain Reflectometry (TDR) Analysis
    5. 4.5 Simulation Integrity Analysis
      1. 4.5.1 Simulator Settings and Model Usage
      2. 4.5.2 Simulation Parameters
      3. 4.5.3 Simulation Methodology
    6. 4.6 Reviewing Simulation Results
  8. 5References
  9. 6Revision History

4.3 S-Parameter Inspection

Once the extracted S-parameters have been verified as causal and passive, the S-parameter plots should be inspected. It is recommended to check for the following:

  • Insertion Loss: The single-ended insertion loss is recommended to stay within 0 to 10dB up to 3 times the Nyquist frequency of operation. For example, if the target frequency is 8Gbps (4GHz Nyquist), the single-ended insertion loss should stay under 10dB up to 12GHz.
  • Return Loss: The single-ended return loss is recommended to be less than 15dB up to 3 times the Nyquist frequency.
  • Near and Far end crosstalk (FEXT/NEXT): The FEXT and NEXT are recommended to be under 25dB for frequencies up to 3 times the Nyquist frequency