SPRUJ07 august   2023 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between F2837x and F28P65x
    1. 1.1 F2837x and F28P65x Feature Comparison
  5. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 176-Pin PTP and 100-Pin PZP Package
    2. 2.2 Use of Existing 176-Pin F2837x PCB Design
      1.      9
      2. 2.2.1 JTAG TRSTn No-Connect
      3. 2.2.2 GPIO Input Buffer Control Register
      4. 2.2.3 176-Pin GPIO Pin/Multiplex and ADCD Considerations
        1. 2.2.3.1 176-Pin PTP Pins with Different GPIO Assignment
        2. 2.2.3.2 ADCD Channel Migration
    3. 2.3 176-Pin PTP New PCB Design
    4. 2.4 100-Pin PZP New PCB Design
    5. 2.5 337-BGA ZWT Application to 256-BGA ZEJ or 169-BGA NMR
  6. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28P65x
      1. 3.1.1 Lock-step Compare Module (LCM)
      2. 3.1.2 Expanded Analog Channels
      3. 3.1.3 Firmware Update (FWU)
      4. 3.1.4 Flexible GPIO and Digital Input Pins
      5. 3.1.5 ADC Hardware Redundancy Safety Checker
      6. 3.1.6 Flexible Memory Sharing between CPU Subsystems
      7. 3.1.7 Increased RAM Program Memory on CLA
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
        1. 3.5.1.1 F2837x vs F28P65x PIE Channel Mapping Comparison
      2. 3.5.2 Bootrom
      3. 3.5.3 AGPIO Filter
    6. 3.6 Power Management
      1. 3.6.1 VREGENZ
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
      1. 3.8.1 F2837x vs F28P65x GPIO Mux Comparison
    9. 3.9 Analog Multiplexing Changes
      1. 3.9.1 F2837x_176PTP vs F28P65x_176PTP Analog Connections Comparison
  7. 4Application Code Migration From F2837x to F28P65x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  8. 5EABI Support
    1. 5.1 NoINIT Struct Fix (Linker Command)
    2. 5.2 Pre-Compiled Libraries
  9.   References

Abstract

This migration guide describes the hardware and software differences to consider when moving between F2837x/F2807x and F28P65x C2000™ MCUs. This document shows the block diagram between the two MCUs as a visual representation on what blocks are similar or different. It also highlights the features that are unique between the two devices for all available packages in device comparison table. To facilitate application and hardware migration between F2837x and F28P65x devices, the PCB hardware section provides guidance on how to proceed with the common 176-pin package. A supplemental topic was included with recommendations for designing a 100-pin hardware that works for both F2837x and F28P65x 100-pin devices for early development of F28P65x application using F2837x 100-pin device. The digital general-purpose input/output (GPIO) and analog multiplex comparison tables show pin functionality between the two MCUs. F2807x is a single CPU, 120MHz variant of F2837x with only the 176-pin and 100-pin packages availble. The device comparison table only compares the superset F2837x device that has the complete set of peripherals and pins. Consult the F2807x datasheet for the more information on the available peripherals and pins if this will be used in migration. This serves as a reference for hardware design and signal routing when considering a move between the two devices. Lastly, the F28P65x software support is only in EABI format. The EABI migration is discussed in Section 5.