SPRUJ07 august   2023 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between F2837x and F28P65x
    1. 1.1 F2837x and F28P65x Feature Comparison
  5. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 176-Pin PTP and 100-Pin PZP Package
    2. 2.2 Use of Existing 176-Pin F2837x PCB Design
      1.      9
      2. 2.2.1 JTAG TRSTn No-Connect
      3. 2.2.2 GPIO Input Buffer Control Register
      4. 2.2.3 176-Pin GPIO Pin/Multiplex and ADCD Considerations
        1. 2.2.3.1 176-Pin PTP Pins with Different GPIO Assignment
        2. 2.2.3.2 ADCD Channel Migration
    3. 2.3 176-Pin PTP New PCB Design
    4. 2.4 100-Pin PZP New PCB Design
    5. 2.5 337-BGA ZWT Application to 256-BGA ZEJ or 169-BGA NMR
  6. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28P65x
      1. 3.1.1 Lock-step Compare Module (LCM)
      2. 3.1.2 Expanded Analog Channels
      3. 3.1.3 Firmware Update (FWU)
      4. 3.1.4 Flexible GPIO and Digital Input Pins
      5. 3.1.5 ADC Hardware Redundancy Safety Checker
      6. 3.1.6 Flexible Memory Sharing between CPU Subsystems
      7. 3.1.7 Increased RAM Program Memory on CLA
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
        1. 3.5.1.1 F2837x vs F28P65x PIE Channel Mapping Comparison
      2. 3.5.2 Bootrom
      3. 3.5.3 AGPIO Filter
    6. 3.6 Power Management
      1. 3.6.1 VREGENZ
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
      1. 3.8.1 F2837x vs F28P65x GPIO Mux Comparison
    9. 3.9 Analog Multiplexing Changes
      1. 3.9.1 F2837x_176PTP vs F28P65x_176PTP Analog Connections Comparison
  7. 4Application Code Migration From F2837x to F28P65x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  8. 5EABI Support
    1. 5.1 NoINIT Struct Fix (Linker Command)
    2. 5.2 Pre-Compiled Libraries
  9.   References

2 PCB Hardware Changes

The common packages between F2837x and F28P65x devices are 176-Pin PTP and 100-Pin PZ. It is possible to drop-in a 176-pin F28P65x device on an existing F2837x application board and this section covers how to go about such migration and other considerations for pin assignments that have changed. The drop-in migration is covered in Section 2.2.

A supplemental topic has been added to this section about designing a common 176-Pin and 100-Pin board to accommodate both F2837x and F28P65x device for early development with F2837x that would eventually be replaced with F28P65x part. This topic is covered in Section 2.3 and Section 2.4, respectively.

In some cases, an existing application on the superset F2837x 337-BGA ZWT package might be moving to either the F28P65x 256-BGA ZEJ or 169-BGA NMR package. Section 2.5 provides some guidelines when considering F28P65x BGA devices.

Note: Overall compatibility depends on more than just the pins. Please review all the changes in this document during the migration process.