SBOA344A July   2019  – September 2022 LMX2694-SEP , SN55HVD233-SEP , SN65C1168E-SEP , TL7700-SEP , TLV1704-SEP , TPS73801-SEP , TPS7H1111-SEP , TPS7H1210-SEP , TPS7H2140-SEP , TPS7H2201-SEP , TPS7H2211-SEP , TPS7H2221-SEP , TPS7H3302-SEP , TPS7H4003-SEP , TPS7H4010-SEP , TPS7H5005-SEP , TPS7H5006-SEP , TPS7H5007-SEP , TPS7H5008-SEP

 

  1.   Abstract
  2.   Trademarks
  3. 1 Radiation Challenges
  4. 2 Temperature Range
  5. 3 Tin Whiskers
  6. 4 Cu Wire Risks
  7. 5 Plastic Outgassing and Moisture Absorption
  8. 6 Harsh Environment Qualification
  9. 7 Multiple Manufacturing Sites
  10. 8 Long Life Cycles
  11. 9 VID - Vendor Item Drawing
  12. 10Conclusions
  13. 11Revision History

5 Plastic Outgassing and Moisture Absorption

A common concern in using PEMs for space systems is that the packaging material is an organic mold compound that can absorb moisture and outgas organic compounds. Moisture absorption can result in reduced reliability and lifetime of a product. Outgassing constituents can condense on other components, contaminating them and impacting their performance. It is a major problem for sensors, such as imaging sensors.

The semiconductor industry uses many different mold compounds depending upon the product type, package size and architecture, application, and available mold compounds at the assembly site. Different mold compounds have different moisture sensitivity levels and outgassing.

TI's Space EP products use enhanced mold compounds and go through extended qualification testing, beyond what is required for automotive products by AEC-Q100.

The mold compounds used on Space EP products exceed the NASA driven outgassing requirements in ASTM E-495 of Total Mass Loss (TML) of less than 1.0% and a Collected Volatile Condensable Material (CVCM) of less than 0.1%.