SCHS047M August   1998  – November 2024 CD4051B , CD4051B-MIL , CD4052B , CD4052B-MIL , CD4053B , CD4053B-MIL

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AC Performance Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Detailed Design Procedure

  1. Recommended Input Conditions:
    • For switch time specifications, see propagation delay times in Electrical Characteristics.
    • Inputs should not be pushed more than 0.5 V above VDD or below VEE.
    • For input voltage level specifications for control inputs, see VIH and VIL in Electrical Characteristics.
  2. Recommended Output Conditions:
    • Outputs should not be pulled above VDD or below VEE.
  3. Input or output current consideration:
    • The CD405xB series of parts do not have internal current drive circuitry and thus cannot sink or source current. Any current will be passed through the device.