SCHS047M August   1998  – November 2024 CD4051B , CD4051B-MIL , CD4052B , CD4052B-MIL , CD4053B , CD4053B-MIL

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AC Performance Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Electrical Characteristics

Over operating free-air temperature range, VSUPPLY = ±5 V, and RL = 100 Ω, (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SIGNAL INPUTS (VIS) AND OUTPUTS (VOS)
VIS (V) VEE (V) VSS (V) VDD (V) TEMP

Quiescent Device Current, IDD Max 
0 V 0 V 5 V –55°C 60 µA
–40°C 60
25°C 17 60
85° 150
125°C 150
0 V 0 V 10 V –55°C 60
–40°C 60
25°C 18 60
85°C 300
125°C 300
0 V 0 V 15 V
 
–55°C 60
–40°C 60
25°C 18 60
85°C 600
125°C 600
0 V 0 V 20 V –55°C 100
–40°C 100
25°C 18 100
85°C 3000
125°C 3000
Drain to Source ON Resistance rON Max0 ≤ VIS ≤ VDD 0 V 0 V 5 V –55°C 800 Ω
–40°C 850
25°C 470 1050
85°C 1200
125°C 1300
0 V 0 V 10 V –55°C 310
–40°C 300
25°C 180 400
85° 520
125°C 550
0 V 0 15 V –55°C 200
–40°C 210
25°C 125 240
85°C 300
125°C 300
Change in ON Resistance(Between Any Two Channels), ΔRON 0 V 0 V 5 V 25°C 15 Ω
0 V 0 V 10 V 10
0 V 0 V 15 V 5
OFF Channel Leakage Current: Any Channel OFF (Max)
or ALL Channels OFF (COMMON OUT/IN) (Max)
0 V 0 V 18 V  –55°C ± 100 nA
–40°C ± 100
25°C ± 0.3 ± 100(2)
85°C ± 1000(2)
125°C ± 1000(2)
ON Channel Leakage Current: Any Channel ON (Max) or
ALL Channels ON (COMMON OUT/IN) (Max)
5 or 0 –5 V 0 V 10.5 V 85°C ± 300 nA
5 0 V 0 V 18 V 85°C ± 300
Capacitance Input, CIS 0 V 0 V 10 V 25°C 5 pF
Output, COS CD4051 30
Output, COS CD4052 18
Output, COS CD4053 9
Feed through, CIOS 0.2
Prop Delay VDD RL = 200 kΩ 5 V 25°C 30 60 ns
CL = 50 pF 10 V 15 30
tr, tf = 20 ns 15 V 10 20
CONTROL (ADDRESS OR INHIBIT), V
Input Low Voltage, VIL, Max 5 V –55°C 0.8 V
–40°C 0.8
25°C 0.8
85°C 0.8
125°C 0.8
10 V –55°C 0.8
–40°C 0.8
25°C 0.8
85°C 0.8
125°C 0.8
15 V –55°C 0.8
–40°C 0.8
25°C 0.8
85°C 0.8
125°C 0.8
Input High Voltage, VIH, Min 5 V –55°C 3.5 V
–40°C 3.5
25°C 3.5
85°C 3.5
125°C 3.5
10 V –55°C 7
–40°C 7
25°C 7
85°C 7
125°C 7
15 V –55°C 11
–40°C 11
25°C 11
85°C 11
125°C 11
Input current, IIN (Max) VIN = 0, 18 18 V –55°C ±1 µA
–40°C ±1
25°C ±0.6 ±1
85°C ±1
125°C ±1
Propagation Delay Time Address-to-Signal OUT (Channels ON or OFF) (See Figure 10, Figure 11, and Figure 15) tr, tf = 20ns, CL = 50pF, RL = 10kΩ 0 V 0 V 5 V 450 720 ns
0 V 0 V 10 V 160 320
0 V 0 V 15 V 120 240
–5 V 0 V 5 V 225 450
Propagation Delay Time Inhibit-to-Signal OUT (Channel Turning ON) (See Figure 11) tr, tf = 20ns, CL = 50pF, RL = 1kΩ 0 V 0 V 5 V 400 720 ns
0 V 0 V 10 V 160 320
0 V 0 V 15 V 120 240
–10 V 0 V 5 V 200 400
Propagation Delay Time Inhibit-to-Signal OUT (Channel Turning OFF) (See Figure 17) tr, tf = 20ns, CL = 50pF, RL = 10kΩ 0 V 0 V 5 V 200 450 ns
0 V 0 V 10 V 90 210
0 V 0 V 15 V 70 160
–10 V 0 V 5 V 130 300
Input Capacitance, CIN (Any Address or Inhibit Input) –5 V 0 V 5 V 25°C 5 7.5 pF
Peak-to-Peak voltage symmetrical about (VDD – VEE) / 2.
Determined by minimum feasible leakage measurement for automatic testing.