SLAAEI9 December   2023 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3519 , MSPM0L1105 , MSPM0L1106 , MSPM0L1117 , MSPM0L1227 , MSPM0L1228

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1MSPM0 Portfolio Overview
    1. 1.1 Introduction
    2. 1.2 Portfolio Comparison of STM8 MCUs to MSPM0 MCUs
  5. 2Ecosystem And Migration
    1. 2.1 Ecosystem Comparison
      1. 2.1.1 MSPM0 Software Development Kit (MSPM0 SDK)
      2. 2.1.2 The IDE Supported By MSPM0
      3. 2.1.3 SysConfig
      4. 2.1.4 Debug Tools
      5. 2.1.5 LaunchPad
    2. 2.2 Migration Process
      1. 2.2.1 Step 1. Choose The Right MSPM0 MCU
      2. 2.2.2 Step 2. Set Up IDE And Quick Introduction of CCS
        1. 2.2.2.1 Set Up IDE
        2. 2.2.2.2 Quick Introduction of CCS
      3. 2.2.3 Step 3. Set Up MSPM0 SDK And Quick Introduction of MSPM0 SDK
        1. 2.2.3.1 Set Up MSPM0 SDK
        2. 2.2.3.2 Quick Introduction of SDK
      4. 2.2.4 Step 4. Software Evaluation
      5. 2.2.5 Step 5. PCB Board Design
      6. 2.2.6 Step 6. Mass Production
    3. 2.3 Example
  6. 3Core Architecture Comparison
    1. 3.1 CPU
    2. 3.2 Embedded Memory Comparison
      1. 3.2.1 Flash and EEPROM Features
      2. 3.2.2 Flash and EEPROM Organization
        1. 3.2.2.1 Flash and EEPROM Regions
        2. 3.2.2.2 NONMAIN Memory of MSPM0
      3. 3.2.3 Embedded SRAM
    3. 3.3 Power UP and Reset Summary and Comparison
    4. 3.4 Clocks Summary and Comparison
      1. 3.4.1 Oscillators
      2. 3.4.2 Clock Signal Comparison
    5. 3.5 MSPM0 Operating Modes Summary and Comparison
      1. 3.5.1 Operating Modes Comparison
      2. 3.5.2 MSPM0 Capabilities in Lower Modes
      3. 3.5.3 Entering Lower-Power Modes
      4. 3.5.4 Low-Power Mode Code Examples
    6. 3.6 Interrupts and Events Comparison
      1. 3.6.1 Interrupts and Exceptions
        1. 3.6.1.1 Interrupt Management of MSPM0
        2. 3.6.1.2 Interrupt Controller (ITC) of STM8
      2. 3.6.2 Event Handler of MSPM0
      3. 3.6.3 Event Management Comparison
    7. 3.7 Debug and Programming Comparison
      1. 3.7.1 Debug Mode Comparison
      2. 3.7.2 Programming Mode Comparison
        1. 3.7.2.1 Bootstrap Loader (BSL) Programming Options
  7. 4Digital Peripheral Comparison
    1. 4.1 General-Purpose I/O (GPIO, IOMUX)
    2. 4.2 Universal Asynchronous Receiver-Transmitter (UART)
    3. 4.3 Serial Peripheral Interface (SPI)
    4. 4.4 Inter-integrated Circuit Interface (I2C)
    5. 4.5 Timers (TIMGx, TIMAx)
    6. 4.6 Windowed Watchdog Timer (WWDT)
  8. 5Analog Peripheral Comparison
    1. 5.1 Analog-to-Digital Converter (ADC)
    2. 5.2 Comparator (COMP)
    3. 5.3 Voltage References (VREF)

3.2.2.1 Flash and EEPROM Regions

Table 3-3 shows the flash and EEPROM regions of STM8 devices and MSPM0 devices.

Table 3-3 The Flash and EEPROM Regions
STM8L & STM8S MSPM0L & MSPM0C
Main program area Application code. MAIN Application code and data.
Opetion bytes Configuration of device hardware features and memory protection. NONMAIN BCR configuration.
Proprietary code area(PCODE)(1) Protecting proprietary software libqraries used to drive peripherals.
BSL configuration.
User boot area (UBC)(2) The reset and the interrupt vectors.
FACTORY Device ID, and other parameters.
Data EEPROM Application data. DATA(3) Data or EEPROM emulation.
(1) The PCODE is available only in low, medium+ and high-density devices.
(2) STM8Sx03xx, STM8S001xx, STM8L101xx and STM8L001xx don't have embedded bootloader (no ROM bootloader is implemented inside the microcontroller). When using these devices, the user has to write his own bootloader code and save his own bootloader in the UBC program area.
(3) MSPM0 devices with one bank implement the FACTORY, NONMAIN, and MAIN regions on BANK0 (the only bank present), and the DATA region is not available. MSPM0 devices with multiple banks also implement FACTORY, NONMAIN, and MAIN regions on BANK0, but include additional banks (BANK1 through BANK4) that can implement MAIN or DATA regions.