SLLSEX2F December   2016  – April 2024 TDP158

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply
    6. 5.6  Electrical Characteristics, Differential Input
    7. 5.7  Electrical Characteristics, TMDS Differential Output
    8. 5.8  Electrical Characteristics, DDC, I2C, HPD, and ARC
    9. 5.9  Electrical Characteristics, TMDS Differential Output in DP-Mode
    10. 5.10 Switching Characteristics, TMDS
    11. 5.11 Switching Characteristics, HPD
    12. 5.12 Switching Characteristics, DDC and I2C
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reset Implementation
      2. 7.3.2  Operation Timing
      3. 7.3.3  Lane Control
      4. 7.3.4  Swap
      5. 7.3.5  Main Link Inputs
      6. 7.3.6  Receiver Equalizer
      7. 7.3.7  Input Signal Detect Block
      8. 7.3.8  Transmitter Impedance Control
      9. 7.3.9  TMDS Outputs
      10. 7.3.10 Slew Rate Control
      11. 7.3.11 Pre-Emphasis
      12. 7.3.12 DP-Mode Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 DDC Training for HDMI 2.0 Data Rate Monitor
      2. 7.4.2 DDC Functional Description
    5. 7.5 Register Maps
      1. 7.5.1  Local I2C Control BIT Access TAG Convention
      2. 7.5.2  BIT Access Tag Conventions
      3. 7.5.3  CSR Bit Field Definitions, DEVICE_ID (address = 00h≅07h)
      4. 7.5.4  CSR Bit Field Definitions, REV_ID (address = 08h )
      5. 7.5.5  CSR Bit Field Definitions – MISC CONTROL 09h (address = 09h)
      6. 7.5.6  CSR Bit Field Definitions – MISC CONTROL 0Ah (address = 0Ah)
      7. 7.5.7  CSR Bit Field Definitions – MISC CONTROL 0Bh (address = 0Bh)
      8. 7.5.8  CSR Bit Field Definitions – MISC CONTROL 0Ch (address = 0Ch)
      9. 7.5.9  CSR Bit Field Definitions, Equalization Control Register (address = 0Dh)
      10. 7.5.10 CSR Bit Field Definitions, POWER MODE STATUS (address = 20h)
      11. 7.5.11 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 30h)
      12. 7.5.12 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 31h)
      13. 7.5.13 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 32h)
      14. 7.5.14 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 33h)
      15. 7.5.15 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 34h)
      16. 7.5.16 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 35h)
      17. 7.5.17 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Dh)
      18. 7.5.18 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Eh)
      19. 7.5.19 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Fh)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source Side
        2. 8.2.2.2 DDC Pull Up Resistors
      3. 8.2.3 Application Curves
      4. 8.2.4 Application with DDC Snoop
        1. 8.2.4.1 Source Side HDMI Application
      5. 8.2.5 9.1.2 Source Side HDMI /DP Application Using DP-Mode
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Management
      2. 8.3.2 Standby Power
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision E (July 2022) to Revision F (April 2024)

  • Updated the format of the Package Information table to include package leadsGo
  • Changed VDD(ramp) and VCC(ramp) min requirement from 0.2 ms to 0.002 ms in the Operation Timing sectionGo

Changes from Revision D (March 2020) to Revision E (July 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added inclusive terminology throughout the data sheetGo
  • Updated the TDP158 in Source Side Application figure with ESD between device and receptacleGo
  • Updated the TDP158 Source Side Application with DDC Snoop figure with ESD between device and receptacleGo
  • Updated the TDP158 in Dual Role Source Side Application figure with ESD between device and receptacleGo

Changes from Revision C (October 2019) to Revision D (March 2020)

  • Changed HDMI 2.0a to HDMI 2.0b Go

Changes from Revision B (June 2017) to Revision C (October 2019)

  • Deleted Feature: Both Extended Commercial and Industrial Temperature Device OptionsGo
  • Changed Feature: From: Pin Compatible to the SN65DP159RSB and SN75DP159RSB Retimer To: Pin Compatible to the SN75DP159RSB RetimerGo
  • Deleted TDP158I from the Device Information tableGo
  • Changed the TJ MIN value From: –40°C To: 0°C in the Recommended Operating Conditions tableGo
  • Deleted TA for TDP158I in the Recommended Operating Conditions tableGo
  • Changed the last sentence of the Overview section to remove the TDP158I deviceGo

Changes from Revision A (January 2017) to Revision B (June 2017)

  • Changed the title From: "HDMI ™ Redriver" To: "HDMI ™ Level Shifter Redriver"Go
  • Changed the Features ListGo
  • Changed the Applications ListGo
  • Added text to pins 17, 23, 34, 16 in the Pin Functions table: "For pin control, Low = 1kΩ pulldown resistor to GND, High = 1kΩ pullup resistor to VCC, NC = Floating" Go
  • Added text to pin NC in the Pin Functions table: "Optionally connect 0.1μF to GND to reduce noise"Go
  • VSADJ: Added Note "Reducing resistor ..", and Changed values in the Recommended Operating Conditions tableGo
  • Changed Rvsdj maximum value to 8kΩ in VOD Swing vs VASDJ Resistor Value figure Go
  • Changed the paragraph in the Operation Timing sectionGo
  • Added column Pin Number to Swap Function table, Changed IN_CLK → OUT_CLK To: IN_D2 → OUT_D2 in the last row of the SWAP columnGo
  • Changed Note 1 of Receiver EQ Programming and Values table Go
  • Changed the last two sentences of the paragraph in the pre-emphasis sectionGo
  • Changed the title of 6dB Pre-Emphasis Setting in Normal Operation figure from: 3.5dB pre-emphasis in Normal Operation to: 6dB pre-emphasis Setting in Normal OperationGo
  • Changed From: Reg0Ch[1:0] = 01 To: Reg0Ch[1:0] = 10 in 6dB Pre-Emphasis in DP-Mode figureGo
  • Changed the Default setting in REV_ID From: TBD To: 00000001Go
  • Added paragraph to the Application and Implementation section: "TDP158 is designed ..."Go
  • Changed the Application Information paragraphGo
  • Changed From: 0Ω resistors To: 1kΩ resistors, and a noise filter (capacitor) for the no connect in Source Side Application figureGo
  • Added text "1kΩ pulldown resistor " to the connect values in Design Parameters table Go
  • Changed text in the second paragraph of the Source Side HDMI Application section From: "Control pins can be tied directly to VCC, GND or left floating." To: "Control pins should be tied to 1kΩ pullup to VCC, 1kΩ pulldown to GND, or left floating."Go
  • Changed From: 0Ω resistors To: 1kΩ resistors, and a noise filter (capacitor) for the no connect in Source Side Application with DDC Snoop figureGo
  • Changed From: 0Ω resistors To: 1kΩ resistors, and a noise filter (capacitor) for the no connect in Dual Role Source Side Application figureGo
  • Changed From: 0Ω resistors To: 1kΩ resistors, and a noise filter (capacitor) for the no connect in Example Layout for Source Side Application figureGo

Changes from Revision * (December 2016) to Revision A (January 2017)

  • Changed From: Preview To: Production data Go
  • Changed VCC in to show DP mode and HDMI mode in the Recommended Operating Conditions tableGo
  • Changed VIH at OE MIN value From: 2.2 To: 0.7 x VCC Go
  • Changed the I(STBY1) MAX values in the Electrical Characteristics, Power Supply tableGo
  • Changed the Electrical Characteristics, TMDS Differential Output table Go
  • Changed the Switching Characteristics, TMDS table Go
  • Deleted images "TMDS Output Skew Measurements" and "HDMI /DVI TMDS Output Common Mode Measurement" from the Parameter Measurement Information sectionGo
  • Deleted VSADJ = 6kΩ from Output Differential Waveform and Output Differential Waveform with De-Emphasis figureGo
  • Deleted tables "TMDS_CLK Output Slew Rate Control" and "TMDS_D0, D1, D2 Output Slew Rate Control" form the Slew Rate Control sectionGo
  • Deleted VSADJ = 6kΩ from 6dB Pre-Emphasis Setting in Normal Operation and 6dB Pre-Emphasis in DP-Mode figuresGo
  • Changed Example Layout for Source Side Application figure Go