SLVAEZ0 November   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB35-Q1 , TPS2H000-Q1 , TPS2H160-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Trademarks
  2. 1Background
    1. 1.1 High-Side Switch
    2. 1.2 Thermal Modeling Using Electrical Analysis
    3. 1.3 Varying RDSON
  3. 2Using TI's SPICE Models With Incorporated Thermal Behavior
    1. 2.1 Basics of PSpice - Modifying Components
    2. 2.2 Basics of PSpice - Adding Libraries and Components
    3. 2.3 Basics of PSpice - Running Simulations
  4. 3Simulating the Junction Temperature in PSpice
  5. 4How to Leverage Thermal Simulations
  6. 5Model Limitations
  7. 6Conclusion

Using TI's SPICE Models With Incorporated Thermal Behavior

Some models may already have the thermal behavior incorporated and can be found as the transient model under the Design and Development section of a product folder. When opening the file in PSpice, a schematic such as the one in Figure 2-1 is available. The junction temperature of the device has been added as a pin on the device and labeled as “TJ”. It is important to remember that this pin is not physically on the device and is used for ease and simulation purposes. Figure 2-1 shows this implementation.

GUID-A2046959-DCE4-48E9-8775-5AD1FEDFCF81-low.pngFigure 2-1 TPS1HA08C-Q1 Transient Model With Thermal Behavior

Within the schematic, is it possible to modify schematic in ways such as modifying the supply power, V1, controlling the enable time using V2 power supply, and add the characteristics to the load that the device will be powering.

To accurately model operating conditions, the ambient temperature can be modified by editing the “TEMP_AMB” property that has been added. This property refers to the ambient temperature or surrounding temperature that the device will be operating in.