SLVAF93A october 2022 – april 2023 LP8764-Q1 , TPS6594-Q1
The hardware connections are described in the schematic checklist (see Reference 6). Table 2-1 and Table 2-2 show the required connections associated with NVM configuration.
Pin | Name | Purpose | Connection for Functional Use |
---|---|---|---|
2 | VOUT_LDOVINT | Output pins of internal LDOs for noise decoupling capacitor | Capacitor: Ctyp = 2.2 µF; Vcap > 6.3 V |
3 | VOUT_LDOVRTC | ||
4 | VCCA | Analog input voltage for the internal LDOs and other internal blocks | Capacitor: Cmin = 0.47 µF; Ctyp = 1 µF; Vcap>6.3 V |
5 | REFGND1 | System reference ground | Connect to solid ground plane but not the thermal pad on the top layer. |
6 | REFGND2 | ||
30 | SDA_I2C1, SDI_SPI | I2C or SPI data | Connect to data line of controller. For I2C use resistor value depending upon speed and PCB. |
31 | SCL_I2C1/SCK_SPI | I2C or SPI clock | Connect to clock line of controller. For I2C use resistor value depending upon speed and PCB. |
32 | CS_SPI1 | SPI Chip select | Connect to CS of SPI controller |
33 | SDO_SPI1 | SPI SDO | Connect to SDO of SPI controller |
48 | VIO_IN | Digital supply input for GPIOs and I/O supply voltage | Capacitor: Cmin = 0.47 µF; Ctyp = 1 µF; Vcap > 6.3 V |
57 | Thermal Pad | Power ground, which is also the thermal pad of the package. | Connect to top layer power ground polygon |
Pin | Name | Purpose | Connection for functional use |
---|---|---|---|
20 | VOUT_LDO | Output pin of internal LDO for noise decoupling capacitor | Capacitor: Ctyp = 2.2 µF; Vcap > 6.3 V |
18 | VCCA | Analog input voltage for the internal LDOs and other internal blocks | Capacitor: Cmin = 0.1 µF; Ctyp = 0.47 µF; Vcap > 6.3 V |
19 | AGND1 | System reference ground | Connect to solid ground plane but not the thermal pad on the top layer. |
21 | AGND2 | ||
5 | SDA_I2C1, SDI_SPI | I2C or SPI data | Connect to data line of controller. For I2C use resistor value depending upon speed and PCB. |
4 | SCL_I2C1/SCK_SPI | I2C or SPI clock | Connect to clock line of controller. For I2C use resistor value depending upon speed and PCB. |
2 | CS_SPI(1) | SPI Chip select | Connect to CS of SPI controller |
3 | SDO_SPI(1) | SPI SDO | Connect to SDO of SPI controller |
24 | VIO | Digital supply input for GPIOs and I/O supply voltage | Capacitor: Cmin = 0.1µF; Ctyp = 0.47 µF; Vcap > 6.3 V |
13/29 | PGND | Power Ground | Connect to top layer power ground polygon |
VCCA and VIO must be applied and the serial interface must be accessible to update the NVM. The VIO must not be connected to or dependent upon any GPIO or regulator from the PMIC. Similarly, in the case of an I2C serial interface, the pullup voltage must also be independent of the PMIC. When configuring the NVM via I2C only the I2C1 interface is needed. The I2C2 interface is only used in the application when enabled and utilized solely for the watchdog communication.
The initial PMIC state must also be understood before attempting to configure the NVM. Generally, the PMIC must be in a static or idle state. In some NVM configurations, the PMIC does not power up until the ENABLE pin is activated. Simply holding the ENABLE pin low can be an effective means to hold the PMIC in a known static state.
Also, if the NVM is configured to loop continuously between states polling for a certain condition, this can interfere with the initial steps in the configuration which unlocks the NVM.
Finally, the PMIC does allow for the NVM to be configured while in the safe recovery hardware state. This provides a means to change the NVM in the event that the NVM was erroneously configured and results in an error or shutdown. When defining an NVM, a transition to the safe recovery state is important and must not be omitted. Examples which include the transition to safe recovery are provided in the Scalable PMIC GUI as templates. If a transition is not provided, then the associated interrupts must be serviced for the NVM to be unlocked successfully.