SLVAFH3 December   2022 TPS6213013A-Q1 , TPS62130A-Q1 , TPS62133A-Q1 , TPS62150A-Q1 , TPS62152A-Q1 , TPS62153A-Q1 , TPS62901-Q1 , TPS62902-Q1 , TPS62903-Q1 , TPS62992-Q1 , TPS62993-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Achieving a Smaller Solution
    1. 2.1 Smaller Package and Fewer External Components
    2. 2.2 Smart Configuration Pin
    3. 2.3 VSET
  5. 3Reducing Power Loss
    1. 3.1 Junction Temperature
    2. 3.2 Automatic Efficiency Enhancement (AEE)
    3. 3.3 Quiescent Current
    4. 3.4 Auto PFM/PWM vs. Forced PWM
  6. 4Application Flexibility
    1. 4.1 1.0 MHz and 2.5 MHz Switching Frequencies
    2. 4.2 Lower and More Accurate Output Voltages
    3. 4.3 Output Voltage Discharge
    4. 4.4 Wettable Flanks
  7. 5Summary
  8. 6References

2.1 Smaller Package and Fewer External Components

The QFN package of TPS629xx-Q1 is half the size of the previous generation, however the size of the package is not the only thing that has shrunk. The total solution size is reduced by 20% of the TPS621x0A-Q1 when compared on their EVMs, with the reduction limited by larger automotive grade capacitors used on the TPS629xx-Q1 versus the standard TPS6290x. To achieve both of these reductions, TPS629xx-Q1 has decreased the number of pins on the package from 16 to 9, allowing the package to shrink and decreasing the passives needed to configure the device. The result saves precious board space, BOM costs and design time.

Figure 2-1 Typical Application Schematic of the TPS621x0A-Q1
Figure 2-2 Typical Application Schematic of the TPS6290x-Q1
Figure 2-3 Typical Application Schematic of the TPS6299x-Q1