Surface mount components only dissipate heat through the PCB. The amount of heat dissipated depends on the thickness and area of the copper foil on the PCB. The thickness and the area need to follow standard specifications, as via holes also have inductance and need to be used only when necessary. For the effective usage of thermal vias, they need to be placed close to the heating element.

The HTSSOP package offers a means of removing heat from the semiconductor die through the exposed thermal pad at the base of the package. While the exposed pad of the package is not directly connected to any leads of the package, it is thermally and weak electrically connected to the substrate (ground) of the device. This connection allows a significant improvement in heat sinking, and it becomes imperative that the PCB is designed with thermal lands, thermal vias, and a ground plane to complete the heat removal system.