SLVUAK3C February   2016  – May 2021 TPS82130 , TPS82140 , TPS82150

 

  1. 1Introduction
    1. 1.1 Performance Specification
    2. 1.2 Thermal Data
    3. 1.3 Modifications
      1. 1.3.1 Input and Output Capacitors
  2. 2Setup
    1. 2.1 Input/Output Connector Descriptions
    2. 2.2 Setup
  3. 3PWR720 EVM Test Results
  4. 4Board Layout
  5. 5Schematic and Bill of Materials
    1. 5.1 Schematic
    2. 5.2 Bill of Materials
  6. 6Revision History

5.2 Bill of Materials

Table 5-1 lists the BOM for this EVM.

Table 5-1 PWR720 EVM Bill of Materials
Count
-001-002-003Ref DesValueDescriptionSizePart NumberManufacturer
111C110 µFCAP, CERM, 10 µF, 25 V, +/- 20%, X7R1206C3216X7R1E106M160AETDK
111C222 µFCAP, CERM, 22 µF, 10 V, +/- 20%, X7S0805C2012X7S1A226M125ACTDK
111C33300 pFCAP, CERM, 3300 pF, 50 V, +/- 5%, C0G/NP0, 06030603StdStd
111C468 µFCAP, TA, 68 µF, 25 V, +/- 20%, 0.125 ohm, SMD7343-43TPSE686M025R0125AVX
111R1124 kRES, 124 k, 1%, 0.1 W, 06030603StdStd
222R2, R3100 kRES, 100 k, 1%, 0.1 W, 06030603StdStd
100U1TPS821303A, High Efficiency Step Down MicroSiP Module with Integrated Inductor3 x 2.8 mmTPS82130SILTexas Instruments
010U1TPS821402A, High Efficiency Step Down MicroSiP Module with Integrated Inductor3 x 2.8 mmTPS82140SILTexas Instruments
001U1TPS821501A, High Efficiency Step Down MicroSiP Module with Integrated Inductor3 x 2.8 mmTPS82150SILTexas Instruments