AM26x Family Migration Overview

Abstract

This application note describes the differences between the Texas Instruments' AM263, AM263P and AM261 microcontrollers to outline differences between devices, new features, and what needs to be considered when migrating from one AM26x device to another. Both hardware and software changes are covered for the purpose of application migration. This document provides a comprehensive list of feature differences for all AM26x microcontrollers. However, these details are kept at a feature level and specific information about the performance or usage of each feature can be found in the device-specific data sheets, technical reference manuals, or software user guides. Features that are identical between the devices are not included outside of the Device Comparison table.

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1 Feature Differences Between AM26x Devices

Device Comparison provides a feature-level comparison between the AM26x superset devices: AM2634, AM263P4 and AM2612.

Table 1-1 Device Comparison

Features	Reference Name	AM2634	AM263P4	AM2612
Processors and Accelerators
Arm Cortex-R5F	R5FSS	4	4	2
Trigonometric Math Unit	TMU	No	Yes	Yes
Hardware Security Module	HSM	Yes	Yes	Yes
Crypto Accelerators	Security	Yes	Yes	Yes
Program and Data Storage
On-Chip Shared Memory (RAM)	OCSRAM	Grade N: 1 MB Grade O/P: 2 MB	Grade N: 2 MB Grade O/P: 3 MB	Grade M, N: 1MB Grade L/O/P: 1.5MB
R5F Tightly Coupled Memory (TCM)	TCM	Up to 256KB⁽¹³⁾	Up to 512kB⁽¹⁴⁾	Up to 512kB
General-Purpose Memory Controller	GPMC	4MB	None	None⁽⁷⁾ or 4MB
Peripherals
Modular Controller Area Network Interface	MCAN	4	8	2
Full CAN-FD Support	MCAN	4	8	2
General-Purpose I/O	GPIO	Up to 139	Up to 140	Up to 141
Serial Peripheral Interface	SPI	5	8	2⁽⁷⁾ or 4
Universal Asynchronous Receiver and Transmitter	UART	6	6	6
Local Interconnect Network	LIN	5	5	3
Inter-Integrated Circuit Interface	I2C	4	4	3
Analog-to-Digital Converter	ADC	3⁽¹⁾ or 5⁽²⁾	3⁽³⁾ or 5⁽⁴⁾	2⁽⁷⁾ or 3⁽¹⁰⁾
Resolver (ADC12B3M)	RDC	None	0⁽¹¹⁾ or 2⁽¹²⁾	None
Resolver (ADC12B3M)	ADC	None	0⁽¹¹⁾ or 2⁽¹²⁾	None
Comparator Modules	CMPSS	12⁽¹⁾ or 20⁽²⁾	12⁽³⁾ or 20⁽⁴⁾	9
Digital-to-Analog Converter	DAC	1	1	1
Programmable Real-Time Unit Subsystem⁽⁵⁾	PRU-ICSS	0 or 1	0 or 1	2⁽⁹⁾
Industrial Communication Subsystem Support⁽⁶⁾	PRU-ICSS	Optional	Optional	Optional
Gigabit Ethernet Interface	CPSW	2	1⁽¹²⁾ or 2⁽¹¹⁾	1
Multi-Media Card/Secure Digital Interface	MMCSD	1	1	0⁽⁸⁾ or 1
Enhanced High-Resolution Pulse-Width Modulator Module	EHRPWM	16⁽¹⁾ or 32⁽²⁾	16⁽³⁾ or 32⁽⁴⁾	10
Enhanced Capture Module	ECAP	5⁽¹⁾ or 10⁽²⁾	8⁽³⁾ or 16⁽⁴⁾	2
Enhanced Quadrature Encoder Pulse Module	EQEP	2⁽¹⁾ or 3⁽²⁾	2⁽³⁾ or 3⁽⁴⁾	2
Sigma Delta Filter Module	SDFM	1⁽¹⁾ or 2⁽²⁾	1⁽³⁾ or 2⁽⁴⁾	0⁽⁷⁾ or 2
Fast Serial Interface	FSI	4x FSI_RX + 4x FSI_TX	4x FSI_RX + 4x FSI_TX	1x FSI_RX + 1x FSI_TX
Quad / Octal SPI Flash Interface	QSPI / OSPI	QSPI	OSPI⁽¹⁵⁾	OSPI⁽¹⁵⁾
Real Time Interrupt	RTI	4	8	4
Windowed Watchdog Timer	WWDT	4	4	4

(1) Standard Analog configuration for AM263 contains 3x ADC, 16x EHRPWM, 5x eCAP, 2x EQEP, 1x SDFM, 12x CMPSS

(2) Enhanced Analog configuration for AM263 contains 5x ADC, 32x EHRPWM, 10x eCAP, 3x EQEP, 2x SDFM, 20x CMPSS

(3) Standard Analog configuration for AM263P contains 3x ADC, 16x EHRPWM, 8x eCAP, 2x EQEP, 1x SDFM, 12x CMPSS

(4) Enhanced Analog configuration for AM263P contains 5x ADC, 32x EHRPWM, 16x eCAP, 3x EQEP, 2x SDFM, 20x CMPSS

(5) AM263/AM263P: Programmable Real-Time Unit Subsystem is available when selecting an orderable part number that includes a feature code of D, E, F, K, L, M, or N. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.

(6) AM263/AM263P: Industrial Communication Subsystem Support is available when selecting an orderable part number that includes a feature code of D, E, F, K, L, M, or N. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.

(7) AM261 ZNC Package does not provide the General-Purpose Memory Controller (GPMC) and only provides 2 SPI, 2 ADC, and 0 SDFM peripheral instances. The SPI instances available are SPI0 and SPI2. The ADC instances available are ADC0 and ADC2.

(8) AM261 ZNC and ZEJ Packages do not provide the MMCSD peripheral.

(9) AM261 ZNC and ZEJ Packages have limitation in PRU-ICSS pin out which limits certain features. Refer to the Device Data sheet for a PRU-ICSS GPIO Signal Descriptions table for a list of pins available and not available per package.

(10) AM261 ZCZ Package only offers six ADC channels per instance of the ADC peripheral for a total of 18 channels. All other package variants offer seven ADC channels per instance for a total of 14 or 21 channels.

(11) AM263P: Applies to devices in the ZCZ-C Package only and have a Special Features code of C. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.

(12) AM263P: Applies to devices in the ZCZ-S Package only and have a Special Features code of F or S. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.

(13) Each R5FSS cluster supports 128-KB of Tightly-Coupled Memory (TCM). When configured as Single-Core or Lockstep operating mode, individual cores can utilize the entire 128-KB of TCM memory, while in Dual-Core mode, each core can only utilize the designated half (64-KB TCM).

(14) Each R5FSS cluster supports 256-KB of Tightly-Coupled Memory (TCM). When configured as Single-Core or Lockstep operating mode, individual cores can utilize the entire 256-KB of TCM memory, while in Dual-Core mode, each core can only utilize the designated half (128-KB TCM).

(15) AM263P/AM261: The Octal SPI (OSPI) Flash Interface can support Quad SPI (QSPI) Flash devices. The differences between QSPI and OSPI are covered in Section 3.1.4.