D3

100% U.S.-based company that develops end-to-end solutions for performance-critical applications.

D3 is a 100% U.S.-based company that develops end-to-end solutions integrating camera, radar, connectivity, embedded processing and AI to deliver advanced perception for performance-critical applications.

They provide product development services focusing on the automotive, industrial, medical, aerospace, and defense markets.

D3's highly experienced radar, image science, and DSP teams specialize in customized solutions for our application-specific processors, including the powerful new C7x DSP.

They accelerate development with off-the-shelf DesignCore® platforms featuring robust hardware and software. Customers can jumpstart projects, reducing time-to-market and risk. D3 offers fast customization to tailor these platforms to your specific needs.

D3 provides in-house original design manufacturing (ODM) services for camera, radar, and processing systems.

AC/DC & DC/DC converters (integrated FET)

TPS62160-Q1 — 3V-17V 1A Automotive Step-Down Converters in 2x2SON

TPS62293-Q1 — Automotive 2.3V to 6V, 2.25MHz Fixed Frequency 1A Buck Converter with 1.8V Fixed Output Voltage

Arm-based processors

TDA2E — SoC processors with graphics and video acceleration for ADAS applications (23mm package)

TDA2EG-17 — SoC processors with graphics and video acceleration for ADAS applications (17mm package)

TDA2HG — SoC processor w/ graphics, video & vision acceleration for ADAS applications

TDA2HV — SoC processor w/ video & vision acceleration for ADAS applications

TDA2LF — SoC processor for ADAS applications

TDA2SG — SoC processor w/ highly-featured graphics, video & vision acceleration for ADAS applications

TDA2SX — SoC processor w/ full-featured graphics, video & vision acceleration for ADAS applications

TDA4VM — Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators

TDA4VM-Q1 — Automotive system-on-a-chip for L2, L3 and near-field analytic systems using deep learning

Automotive mmWave radar sensors

AWR1843 — Single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator

AWR1843AOP — Single-chip 76-GHz to 81-GHz automotive radar sensor integrating antenna on package, DSP and MCU

AWR2944 — Automotive, second-generation 76-GHz to 81-GHz high-performance SoC for corner and long-range radar

AWR6843AOP — Single-chip 60-GHz to 64-GHz automotive radar sensor integrating antenna on package, DSP and MCU

AWRL1432 — Single-chip low-power 76GHz to 81GHz automotive mmWave radar sensor

Digital signal processors (DSPs)

TDA3LA — Low power SoC w/ vision acceleration for ADAS applications

TDA3LX — Low power SoC w/ processing, imaging & vision acceleration for ADAS applications

TDA3MA — Low power SoC w/ full-featured processing & vision acceleration for ADAS applications

TDA3MD — Low power SoC w/ full-featured processing for ADAS applications

TDA3MV — Low power SoC w/ full-featured processing, imaging & vision acceleration for ADAS applications

FPD-Link SerDes

DS90UB953-Q1 — 2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar

Industrial mmWave radar sensors

IWR1443 — Single-chip 76-GHz to 81-GHz mmWave sensor integrating MCU and hardware accelerator

IWR1843 — Single-chip 76-GHz to 81-GHz industrial radar sensor integrating DSP, MCU and radar accelerator

IWR1843AOP — Single-chip 76-GHz to 81-GHz industrial radar sensor integrating antenna on package, DSP and MCU

IWR6843 — Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability

IWR6843AOP — Single-chip 60-GHz to 64-GHz intelligent mmWave sensor with integrated antenna on package (AoP)

IWRL1432 — Single-chip low-power 76GHz to 81GHz industrial mmWave radar sensor

IWRL6432 — Single-chip low-power 57-GHz to 64-GHz industrial mmWave radar sensor

Linear & low-dropout (LDO) regulators

TPS745 — 500-mA, low-IQ, high-accuracy, adjustable ultra-low-dropout voltage regulator with power good

Contact

Resources offered

Code example or demo
Development kit
Evaluation board

Supported regions

China
Europe
India
Japan
North America
Oceania
Rest of Asia
South America

Headquarters

150 Lucius Gordon Drive
West Henrietta, New York, 14586
United States

Resources

Development kit

D3-3P-RVP-TDA2X — D3 DesignCore® RVP-TDA2x development kit for TDA2 processors

The RVP-TDA2x is a multi-camera platform for high-end ADAS systems. It includes two ARM A15 application processors, up to four Vision Acceleration Pac (EVE) coprocessors, and a hardware-accelerated H.264 encoder. The Development Kit supports eight camera inputs, but can be customized as required. (...)

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Development kit

D3-3P-RVP-TDA4VX — D3 DesignCore® RVP-TDA3x development kit for TDA3 processors

The RVP-TDA4Vx is a multi-camera platform that enables synchronous acquisition of eight 2MP FPD-Link™ III SerDes capture streams with real-time processing and analytics. The display port video output features MST technology and supports up to 4 serial displays. The system supports hardware in the (...)

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Development kit

D3-3P-TDA3X-SK — D3 DesignCore® TDA3x automotive starter kit For TDA3 processors

The benchtop starter kit lets you evaluate embedded ADAS technology on an electronic platform designed with production in mind. Based on the Texas Instruments TDA3x advanced vision processor, it enables synchronous acquisition of four FPD-Link III HD data streams (video, radar, lidar, etc.) for (...)

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Evaluation board

D3-3P-D3RCM — D3 DesignCore camera series legacy camera modules

The D3RCM 1.3 MP FPD-Link™ III cameras are rugged camera modules featuring the OmniVision® OV10640 image sensor or the SONY® IMX390 image sensor. They are compatible with D3’s RVPs based on our processors, designed for automotive and performance-critical industrial applications. They have superior (...)

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Evaluation board

D3-3P-DESIGNCORE-CAMERA — D3 DesignCore® camera series camera modules

The D3 camera modules are compatible with multiple TI devices in our power management portfolio. The rugged PRO versions meet IP67 dust & waterproof standards and feature automotive grade image sensors to AEC-Q100 Grade 2 (-40°C to +105°C temperature range).

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Evaluation board

D3-3P-DESIGNCORE-RADAR — D3 Engineering DesignCore® radar evaluation modules

D3's miniature sensors, sensor evaluation boards, and sensor fusion devices allow for fast evaluation of D3 radar modules with our mmWave radar technology. These sensors enable easy integration of radar algorithms for industrial applications. Products range from flexible 60GHz and 77GHz modules, to (...)

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Evaluation board

D3-3P-RVP-TDA3X — D3 RVP-TDA3x development kit for TDA3 processors

The RVP-TDA3x is a multi-camera platform for low-cost Advanced Driver Assistance Systems (ADAS). It includes the Vision Acceleration Pac (EVE), and features an on board ISP (Image Signal Processor). It does not include an ARM core or a CODEC. The development kit supports four camera inputs, but can (...)

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Code example or demo

D3-3P-DEV — D3 support for AI cameras, hardware, drivers and firmware

D3 Engineering is a product development firm, specializing in embedded design solutions, that leverages DesignCore® Platforms and Solutions to get customers to market quicker with reduced risk. They bring over 20 years of experience developing vision and sensing systems for intelligent (...)

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Certain information and resources (including links to non-TI sites) may be provided by a member of TI’s partner network and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of these companies by TI, and shall not be construed as a warranty or representation regarding the suitability of their products or services, either alone or in combination with any TI product or service.